Non-destructive testing. Industrial computed radiography with storage phosphor imaging plates

The manufacturing and non-destructive testing of the superconducting poloidal coil PF1 is one of the tasks of NIIEFA, the member of the international ITER project. Radiographic films were traditionally used for the purposes of radiation non-destructive testing. The technology of computed radiography was used to substitute films. It improved the quality of testing and increased productivity. Comparisons of testing results were carried out using films and imaging plates. The “Test Measurement for Qualification of Computed Radiography method for HI PF1 Weld Seams testing” was developed. It allowed to do testing using imaging plates without installing a duplex wire indicator. Compliance with the standards requirements for unsharpness is confirmed using certified specimens.

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Resolution and Noise Properties of CMOS and CR Digital Radiography Systems

Jurnal Teknologi ◽

10.11113/jt.v52.126 ◽

2012 ◽

Author(s):

Khairul Anuar Mohd Salleh ◽

Wan Muhamad Saridan Wan Hassan ◽

Ab. Razak Hamzah

Keyword(s):

Metal Oxide ◽

Digital Radiography ◽

Computed Radiography ◽

Metal Oxide Semiconductor ◽

Oxide Semiconductor ◽

Noise Power ◽

Non Destructive Testing ◽

Modulation Transfer ◽

Destructive Testing ◽

Non Destructive

Seiring dengan perkembangan teknologi perkomputeran dan pemprosesan imej, radiografi industri berbentuk konvensional telah bertukar arah kepada radiografi industri berasaskan digital. Dalam kajian ini, dua jenis alat radiografi industri digital untuk ujian tanpa memusnah (NDT), iaitu complimentary metal oxide semiconductor (CMOS) dengan jarak piksel 50 μm dan computed radiography (CR) dengan jarak piksel 25 μm telah diuji dan diukur untuk menentukan kesesuaiannya dalam NDT. Pengukuran fungsi hantaran modulasi (MTF) dan spektrum kuasa hingar (NPS) telah dilakukan ke atas kedua–dua peralatan ini bagi menilai kualiti imej yang dihasilkan. Daripada pengukuran dan pengiraan yang dilakukan, purata MTF untuk CR dan CMOS pada modulasi 20% ialah 4.48 kitar/mm dan 2.83 kitar/mm. Untuk NPS pula keputusan menunjukkan CMOS memberikan hingar yang lebih tinggi daripada CR tetapi CR mempunyai keupayaan MTF yang lebih pada ukuran 20% modulasi. Daripada pengukuran dan pengiraan yang dijalankan, dapatlah dikatakan bahawa untuk menjalankan satu ujian NDT, pengguna perlu tahu keupayaan sebenar sesebuah alat dan bagaimana ia dibina supaya ujian NDT memberi gambaran tepat ke atas sesuatu sampel atau barangan yang diuji. Kata kunci: Ujian tanpa memusnah (NDT); radiografi industri berasaskan digital (IDR); fungsi hantaran modulasi (MTF); spektrum kuasa hingar Due to development of computer technology and image processing, conventional industrial radiography has changed to digital radiography system. In this study, two types of industrial digital radiography (IDR) modules for non destructive testing (NDT), namely complimentary metal oxide semiconductor (CMOS) with 50 μm pixel pitch and computed radiography (CR) with 25 μm pixel pitch have been evaluated for NDT applications. The modulation transfer function (MTF) and noise power spectrum (NPS) measurement and calculation were adapted in order to evaluate the image quality of IDR images. From the measurement and calculation, the averaged MTF for CR and CMOS at 20% modulation are 4.48 cycles/mm and 2.83 cycles/mm, respectively. NPS measurement and calculation show that CMOS produced higher noise than CR. The CR system has lower and more stable NPS but has lower modulating capability at 20% compared to the CMOS system. The study shows that in order to perform NDT by using the evaluated modules, the user must know the true capability of system and how it is designed for specific application and discontinuity ditection. Key words: Non destructive testing (NDT); industrial digital radiography (IDR); modulation transfer function (MTF); noise power spectrum (NPS); complimentary metal oxide semiconductor (CMOS) and computed radiography (CR)

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