On-Chip Optical Reflectors with High Reflectance and Low Temperature Sensitivity

2021 ◽  
Vol 41 (4) ◽  
pp. 0423001
Author(s):  
廖莎莎 Liao Shasha ◽  
张甜甜 Zhang Tiantian ◽  
包航 Bao Hang ◽  
刘继伟 Liu Jiwei ◽  
廖希 Liao Xi
Author(s):  
Giannis Giannoulis ◽  
Nikos Iliadis ◽  
Dimitrios Apostolopoulos ◽  
Paraskevas Bakopoulos ◽  
Hercules Avramopoulos ◽  
...  

Materials ◽  
2021 ◽  
Vol 14 (11) ◽  
pp. 3089
Author(s):  
Peilei Zhou ◽  
Wensheng Wang ◽  
Lili Zhu ◽  
Haoyun Wang ◽  
Yongming Ai

This study aims to investigate the performance evolution and mechanism of asphalt under action of chloride salt erosion. Asphalt samples soaked with five different snow melting chloride salt concentrations were taken as the research object. Then, the high-temperature performance, low-temperature performance, temperature sensitivity and asphalt–aggregate adhesion property of asphalt samples were carried out. Additionally, Fourier transform infrared spectroscopy (FTIR) was used to explore the mechanism of chloride salt erosion on asphalt. Test results showed the linear variation relationships of high-temperature performance, low-temperature performance and temperature sensitivity with chloride salt concentrations. The high-temperature performance of asphalt would be improved by chloride snowmelt salt. With the increase in the chloride salt solution concentration, the low-temperature performance of asphalt became worse, and the temperature sensitivity increased. Moreover, after the effect of the chloride salt solution, the asphalt–aggregate adhesion property decreased with the increase in the chloride salt solution concentration. It is necessary to control the amount of chloride snowmelt salt in the actual snow removal projects. Finally, based on Fourier transform infrared spectroscopy, the mechanism of chloride salt erosion on asphalt was preliminarily explored. With the increase in the chloride salt solution concentration, the proportion of light components (saturated fraction, aromatic fraction) in asphalt decreased, and the proportion of heavy components (resin and asphaltene) with good thermal stability increased.


Author(s):  
Zitong Feng ◽  
Vincent Michaud-Belleau ◽  
Jayanta K. Sahu ◽  
Johan Nilsson ◽  
Christophe A. Codemard ◽  
...  

Author(s):  
Fasong Zheng ◽  
Fang Fang ◽  
Weiliang Chen ◽  
Kun Liu ◽  
Shaoyang Dai ◽  
...  

2002 ◽  
Vol 54 (2-3) ◽  
pp. 217-221 ◽  
Author(s):  
Yaowen Wang ◽  
Hongguo Zhang ◽  
Qiang Chen ◽  
Junde Pan ◽  
Longtu Li

2010 ◽  
Vol 2010 (1) ◽  
pp. 000015-000022
Author(s):  
Paul Enquist

3D microelectronics integration and wafer scale packaging promise improvements in functional density and cost compared to conventional 2D microelectronics and packaging technologies. The realization of these improvements will require further adoption of 3D volume manufacturing process technologies. These process technologies will likely include through silicon via (TSV) and die or wafer bonding with and without 3D interconnect. Low temperature direct bond technologies have a number of inherent performance and cost advantages compared to other bonding technologies. This paper describes low temperature direct oxide bond technologies with and without a scalable 3D interconnect developed by Ziptronix and cost savings, performance and applications that will be enabled by adoption of these technologies. Enabled cost savings and performance include system or network-on-chip, system in package, and TSVs. Enabled applications include backside illuminated image sensors, micron-scale pitch vertically integrated image sensor arrays, 3D system-on-chip and 3D network-on-chip.


2018 ◽  
Vol 55 (4) ◽  
pp. 040602
Author(s):  
王永洪 Wang Yonghong ◽  
张明义 Zhang Mingyi ◽  
张春巍 Zhang Chunwei ◽  
白晓宇 Bai Xiaoyu ◽  
刘倩 Liu Qian

2013 ◽  
Vol 38 (19) ◽  
pp. 3795 ◽  
Author(s):  
Pengfei Wang ◽  
Lin Bo ◽  
Chunying Guan ◽  
Yuliya Semenova ◽  
Qiang Wu ◽  
...  

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