The Study on the Nanocutting by Rigid Body Tool at the Gas Environment Using Molecular Dynamics Simulations

2014 ◽  
Vol 494-495 ◽  
pp. 400-403
Author(s):  
Jen Ching Huang ◽  
Fu Jen Cheng
Keyword(s):  
Molecular Dynamics ◽  
Rigid Body ◽  
Equivalent Stress ◽  
Shear Plane ◽  
Nitrogen Gas ◽  
Machined Surface ◽  
Chip Surface ◽  
Single Crystal Copper ◽  
Gas Environment ◽  
Dynamics Simulations

This study successfully simulated the single crystal copper nanocutting with a rigid body tool at the nitrogen gas environment using molecular dynamics, and analyzed the workpiece stress distribution and dislocation during nanocutting. After simulations, a diamond rigid tool with a completely sharp produce a shear plane during cutting. The distribution of equivalent stress was greatest at the shear zone and that residual stress occurred on the machined surface. And the stress gets smaller as the distance from the chip surface is farther.

The Nanocutting by Rigid/Elastic Tools with Nose Radius at the Gas Environment Using Molecular Dynamics Simulations

2014 ◽  
Vol 599-601 ◽  
pp. 507-510
Author(s):  
Jen Ching Huang ◽  
Fu Jen Cheng
Keyword(s):  
Molecular Dynamics ◽  
Rigid Body ◽  
Elastic Body ◽  
Nose Radius ◽  
Nitrogen Gas ◽  
Workpiece Temperature ◽  
Chip Temperature ◽  
Gas Environment ◽  
Dynamics Simulations ◽  
Tool Cutting

.This study successfully simulated the single crystal copper nanocutting by a rigid body /elastic tools with nose radius at the nitrogen gas environment using molecular dynamics, and analyzed the workpiece temperature distribution and dislocation during nanocutting. After simulations, it can be found that when cutting with the elastic body tool, the tool itself was still distorted slightly, however, the cutting results of the elastic tool and the rigid body tool of the tool are not the same. The chip temperature was highest near the central rake and nose.The workpiece temperature when the elastic body tool cutting was lower; the temperature in the nose and rake plane is the highest, the more away from the nose, the lower the temperature.

scholarly journals Liquid-like and rigid-body motions in molecular-dynamics simulations of a crystalline protein

2019 ◽  
Vol 6 (6) ◽  
pp. 064704 ◽  
Author(s):  
David C. Wych ◽  
James S. Fraser ◽  
David L. Mobley ◽  
Michael E. Wall
Keyword(s):  
Molecular Dynamics ◽  
Rigid Body ◽  
Molecular Dynamics Simulations ◽  
Rigid Body Motions ◽  
Dynamics Simulations

Shock melting of single crystal copper with a nanovoid: Molecular dynamics simulations

2012 ◽  
Vol 112 (7) ◽  
pp. 074116 ◽  
Author(s):  
A. M. He ◽  
Suqing Duan ◽  
Jian-Li Shao ◽  
Pei Wang ◽  
Chengsen Qin
Keyword(s):  
Molecular Dynamics ◽  
Single Crystal ◽  
Molecular Dynamics Simulations ◽  
Single Crystal Copper ◽  
Shock Melting ◽  
Dynamics Simulations

scholarly journals A Molecular Dynamics Study of the Effect of Voids on the Deformation Behavior of Nanocrystalline Copper

2007 ◽  
Vol 2007 ◽  
pp. 1-6 ◽  
Author(s):  
Chen Zheng ◽  
Yong-Wei Zhang
Keyword(s):  
Molecular Dynamics ◽  
Crack Propagation ◽  
Triple Junction ◽  
Deformation Behavior ◽  
Tensile Deformation ◽  
Shear Plane ◽  
Tensile Direction ◽  
Nanocrystalline Copper ◽  
Tensile Deformation Behavior ◽  
Dynamics Simulations

Molecular dynamics simulations are performed to study the effect of preexisting ellipsoidal voids on the tensile deformation behavior in nanocrystalline copper. No crack propagation is observed regardless of the orientation of the voids with respect to the tensile direction. However it is found that the voids may assist the shear plane formation via (1) emitting dislocations from the void tips, (2) relieving triple-junction confinement, and (3) catalyzing grain splitting.

Torsion/Simple Shear of Single Crystal Copper

2002 ◽  
Vol 124 (3) ◽  
pp. 322-328 ◽  
Author(s):  
M. F. Horstemeyer ◽  
J. Lim ◽  
W. Y. Lu ◽  
D. A. Mosher ◽  
M. I. Baskes ◽  
...  
Keyword(s):  
Molecular Dynamics ◽  
Finite Element ◽  
Single Crystal ◽  
Molecular Dynamics Simulations ◽  
Simple Shear ◽  
Wave Amplitude ◽  
Finite Element Simulations ◽  
Deformation Wave ◽  
Single Crystal Copper ◽  
Dynamics Simulations

We analyze simple shear and torsion of single crystal copper by employing experiments, molecular dynamics simulations, and finite element simulations in order to focus on the kinematic responses and the apparent yield strengths at different length scales of the specimens. In order to compare torsion with simple shear, the specimens were designed to be of similar size. To accomplish this, the ratio of the cylinder circumference to the axial gage length in torsion equaled the ratio of the length to height of the simple shear specimens (0.43). With the [110] crystallographic direction parallel to the rotational axis of the specimen, we observed a deformation wave of material that oscillated around the specimen in torsion and through the length of the specimen in simple shear. In torsion, the ratio of the wave amplitude divided by cylinder circumference ranged from 0.02–0.07 for the three different methods of analysis: experiments, molecular dynamics simulations, and finite element simulations. In simple shear, the ratio of the deformation wave amplitude divided by the specimen length and the corresponding values predicted by the molecular dynamics and finite element simulations (simple shear experiments were not performed) ranged from 0.23–0.26. Although each different analysis method gave similar results for each type boundary condition, the simple shear case gave approximately five times more amplitude than torsion. We attributed this observation to the plastic spin behaving differently as the simple shear case constrained the dislocation activity to planar double slip, but the torsion specimen experienced quadruple slip. The finite element simulations showed a clear relation with the plastic spin and the oscillation of the material wave. As for the yield stress in simple shear, a size scale dependence was found regarding two different size atomistic simulations for copper (332 atoms and 23628 atoms). We extrapolated the atomistic yield stresses to the order of a centimeter, and these comparisons were close to experimental data in the literature and the present study.

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