scholarly journals Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Latest Plating Equipment for Printed Wiring Board.

1993 ◽  
Vol 44 (7) ◽  
pp. 609-613
Author(s):  
Nobutoshi TAKEMURA
Keyword(s):  
Recent Trend ◽  
Surface Finishing ◽  
Printed Wiring Boards ◽  
Special Issue ◽  
Printed Wiring Board ◽  
Wiring Board

An Efficient Numerical Technique for Thermal Characterization of Printed Wiring Boards

1993 ◽  
Vol 115 (4) ◽  
pp. 366-372 ◽  
Author(s):  
G. G. Stefani ◽  
N. S. Goel ◽  
D. B. Jenks
Keyword(s):  
Numerical Technique ◽  
Thermal Characterization ◽  
Computer Time ◽  
Printed Wiring Boards ◽  
Printed Wiring Board ◽  
Equivalent Parameter ◽  
Finite Element Package ◽  
Multiple Materials ◽  
Wiring Board

Thermal modeling of Surface Mount Technology (SMT) microelectronics packages is difficult due to the complexity of the printed wiring board (PWB) plates through hole (PTH) structure. A simple, yet powerful finite difference based approach, called EPIC (Equivalent Parameter for Interfacial Cells), for modelling complex 2-D and 3-D geometries with multiple materials is used to model the PTH structure. A technique for computing an effective thermal conductivity for the PWB is presented. The results compare favorably with those from a commercially available finite element package but require far less computer time.

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