scholarly journals Effect of Thiocyanate Ions on the Electrodeposition Behavior of Zn-iron-group Metal Alloys in Sulfate Baths.

1997 ◽  
Vol 48 (11) ◽  
pp. 1124-1130 ◽  
Author(s):  
Masaaki YANO ◽  
MAW SOE Win ◽  
Takeshi OHGAI ◽  
Tetsuya AKIYAMA ◽  
Hisaaki FUKUSHIMA
Keyword(s):  
Metal Alloys ◽  
Iron Group ◽  
Group Metal ◽  
Iron Group Metal ◽  
Sulfate Baths

scholarly journals Electrodeposition Behavior and Properties of Iron-group Metal Alloys with W from Ammoniacal Citrate Baths

2000 ◽  
Vol 86 (2) ◽  
pp. 116-122 ◽  
Author(s):  
Akira KUBOTA ◽  
Yasunori TASHIRO ◽  
Kazuhiko YAMASAKI ◽  
Hiroaki NAKANO ◽  
Satoshi OUE ◽  
...  
Keyword(s):  
Metal Alloys ◽  
Iron Group ◽  
Group Metal ◽  
Iron Group Metal

scholarly journals Electrodeposition Behavior of Zn-Iron-group Metal Alloys from Sulfate and Chloride Baths.

1993 ◽  
Vol 33 (9) ◽  
pp. 1009-1015 ◽  
Author(s):  
Hisaaki Fukushima ◽  
Tetsuya Akiyama ◽  
Masaaki Yano ◽  
Tatsuo Ishikawa ◽  
Roland Kammel
Keyword(s):  
Metal Alloys ◽  
Iron Group ◽  
Group Metal ◽  
Iron Group Metal

Electrodeposition of Strained-Layer Superlattices

1996 ◽  
Vol 451 ◽  
Author(s):  
T. P. Moffat
Keyword(s):  
Charge Transfer ◽  
Mass Transport ◽  
Structural Evolution ◽  
Iron Group ◽  
Morphological Instability ◽  
Group Metal ◽  
Iron Group Metal ◽  
Transport Control ◽  
Strained Layer Superlattices ◽  
Interfacial Charge

ABSTRACTA variety of Cu/(Ni, Co) multilayers have been grown on Cu single crystals by pulse plating from an alloy electroplating bath. Copper is deposited under mass transport control while the iron group metal is deposited under interfacial charge transfer control. The structural evolution of these films is influenced by the morphological instability of the mass transport limited copper deposition reaction and the development of growth twins during iron-group metal deposition. Specular films have been obtained for growth on Cu(100) while rough, defective films were typically obtained for growth on Cu(111) and Cu(110).

scholarly journals Electrodeposition Behavior of Fe-W Alloy Plating and Metallic Tungsten Deposition on Iron-Group Metal Cathodes

2018 ◽  
Vol 69 (11) ◽  
pp. 533-535
Author(s):  
Kohei ISHIDA ◽  
Takuo NAKADE ◽  
Tsutomu MORIKAWA ◽  
Masao MIYAKE ◽  
Tetsuji HIRATO
Keyword(s):  
Iron Group ◽  
Group Metal ◽  
Iron Group Metal ◽  
Alloy Plating
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