scholarly journals Electrodeposition Behavior of Fe-W Alloy Plating and Metallic Tungsten Deposition on Iron-Group Metal Cathodes

2018 ◽  
Vol 69 (11) ◽  
pp. 533-535
Author(s):  
Kohei ISHIDA ◽  
Takuo NAKADE ◽  
Tsutomu MORIKAWA ◽  
Masao MIYAKE ◽  
Tetsuji HIRATO
1996 ◽  
Vol 451 ◽  
Author(s):  
T. P. Moffat

ABSTRACTA variety of Cu/(Ni, Co) multilayers have been grown on Cu single crystals by pulse plating from an alloy electroplating bath. Copper is deposited under mass transport control while the iron group metal is deposited under interfacial charge transfer control. The structural evolution of these films is influenced by the morphological instability of the mass transport limited copper deposition reaction and the development of growth twins during iron-group metal deposition. Specular films have been obtained for growth on Cu(100) while rough, defective films were typically obtained for growth on Cu(111) and Cu(110).


2018 ◽  
pp. 97-126
Author(s):  
Tim N. Gieshoff ◽  
Axel Jacobi von Wangelin

2007 ◽  
Vol 115 (1348) ◽  
pp. 929-933 ◽  
Author(s):  
Keitaro TEZUKA ◽  
Hirokatsu TAKAGI ◽  
Ryoko KURIHARA ◽  
Yue Jin SHAN ◽  
Hideo IMOTO

1997 ◽  
Vol 48 (11) ◽  
pp. 1124-1130 ◽  
Author(s):  
Masaaki YANO ◽  
MAW SOE Win ◽  
Takeshi OHGAI ◽  
Tetsuya AKIYAMA ◽  
Hisaaki FUKUSHIMA

2006 ◽  
Vol 15 (4-8) ◽  
pp. 1080-1084 ◽  
Author(s):  
Yasuzumi Yamada ◽  
Yu-ki Hosono ◽  
Nobuyuki Murakoshi ◽  
Na-oki Higashi ◽  
Hiro-aki Ichi-oka ◽  
...  

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