scholarly journals On future packaging Technology and Science

2021 ◽  
Author(s):  
Jun Wang
Keyword(s):  
Packaging Technology

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
Mamoru Mohri ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
Wafer Level Packaging

Development of Silicon Wafer Packaging Technology for Deep UV LED

2020 ◽  
Vol 140 (7) ◽  
pp. 152-157
Author(s):  
Hirofumi Chiba ◽  
Yukio Suzuki ◽  
Yoshiaki Yasuda ◽  
Mitsuyasu Kumagai ◽  
Takaaki Koyama ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Packaging Technology ◽  
Uv Led ◽  
Deep Uv

scholarly journals Vacuum Packaging Technology of AC-PDP using Direct-Joint Method

2001 ◽  
Vol 2 (4) ◽  
pp. 34-38 ◽  
Author(s):  
Duck-Jung Lee ◽  
Yun-Hi Lee ◽  
Gwon-Jin Moon ◽  
Jun-Dong Kim ◽  
Won-Do Choi ◽  
...  
Keyword(s):  
Vacuum Packaging ◽  
Packaging Technology ◽  
Joint Method

Nanocellulose‐Based Multidimensional Structures for Food Packaging Technology

2021 ◽  
pp. 305-321
Author(s):  
Saumya Chaturvedi ◽  
Sadaf Afrin ◽  
Mohd S. Ansari ◽  
Zoheb Karim
Keyword(s):  
Food Packaging ◽  
Packaging Technology

Suspended high Q integrated inductor by wafer level packaging technology

2013 ◽  
Vol 21 (1) ◽  
pp. 215-219 ◽  
Author(s):  
M. Han ◽  
S. F. Wang ◽  
G. W. Xu ◽  
Le Luo
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
High Q ◽  
Integrated Inductor ◽  
Wafer Level Packaging
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