Analysis of the Grinding Characteristics of β-Ga2O3 Crystal on Different Planes

The (010) and (100) planes of a [Formula: see text]-Ga2O3 crystal were subjected to precision grinding tests with a resin bond diamond grinding wheel on a precision surface grinding machine. The grinding characteristics and surface grinding quality of the planes of the [Formula: see text]-Ga2O3 crystal were analyzed on the basis of grinding force, grinding force ratio, specific energy, and surface morphology. The (010) plane shows a larger grinding force and specific energy but a smaller grinding force ratio compared with the (100) plane. Under experimental conditions, the normal and tangential grinding forces of the (010) plane are 1.4–2.2 and 2.6–7.8 times that of the (100) plane, respectively. The specific energy of the (010) plane is 2.8–6.1 times that of the (100) plane, and the grinding force ratio of the (100) plane is 1.4–3.7 times that of the (010) plane. Under the same grinding conditions, the material removal methods for the two planes are evidently different. The (010) plane is mainly removed by brittle fracture and accompanied by a minimal broken area, whereas the (100) plane is mainly removed by cleavage layering and exhibits numerous block cleavage. The (100) plane is the strong cleavage surface, and the (100) plane demonstrates a higher surface roughness than the (010) plane under the same grinding conditions.

Study on Effects of Ultrasonic Vibration on Grinding Force

The mathematical models of the dynamic grinding force and the average grinding force were established by introducing the unit grinding force Fu. And the formula of the average grinding force in the grinding zone was derived. The experiments were conducted in the traditional grinding (TG) mode and tangential ultrasonic vibration grinding (TUAG) mode. The results show that the unit grinding force in TUAG is lower than that in TG in the same machining condition; the grinding force ratio is decreased due to the tangential ultrasonic vibration of the workpiece. It is helpful to improve the machinablity of the hard-brittle material.

Analysis on Grinding Force of SiCp/Al Composites Based on MATLAB

SiCp/Al composites were grinded with Diamond Wheel on high-precision machine. Acquiring grinding force signals of the experiment with High Speed Advantech PCI－1712 board. Acquired grinding force signals are analyzed in MATLAB which has mighty function disposing signals. Through analyzing the grinding force in time field, frequency field and the signals wavelet analysis for different grinding parameters, found that the feed velocity has much more influence on the grinding force, the grinding force ratio and the standard variance of the grinding force than the depth of grinding when the velocity of the Diamond Wheel is fixed. The frequency structure and energy distribution of grinding force are showed in PSD analysis. The signals are de-noised in wavelet tools. The result of the experiment indicates the grinding force increases, the grinding force ratio decreases and the standard variance of the grinding force varies complex for different material with the increasing of the velocity of the workpiece and the grinding depth.