Lead‐free Soldering Process Development and Reliability
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TOTAL DOCUMENTS

15

(FIVE YEARS 15)

H-INDEX

0

(FIVE YEARS 0)

Published By Wiley

9781119482031, 9781119482093

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Intermetallic Compounds

Lead‐free Soldering Process Development and Reliability ◽

10.1002/9781119482093.ch12 ◽

2020 ◽

pp. 381-428

Author(s):

Alyssa Yaeger ◽

Travis Dale ◽

Elizabeth McClamrock ◽

Ganesh Subbarayan ◽

Carol Handwerker

Keyword(s):

Intermetallic Compounds

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Solder Paste and Flux Technology

Lead‐free Soldering Process Development and Reliability ◽

10.1002/9781119482093.ch4 ◽

2020 ◽

pp. 73-93

Author(s):

Shantanu Joshi ◽

Peter Borgesen

Keyword(s):

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Conformal Coatings

Lead‐free Soldering Process Development and Reliability ◽

10.1002/9781119482093.ch13 ◽

2020 ◽

pp. 429-465

Author(s):

Jason Keeping

Keyword(s):

Conformal Coatings

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Underfills and Encapsulants Used in Lead‐Free Electronic Assembly

Lead‐free Soldering Process Development and Reliability ◽

10.1002/9781119482093.ch10 ◽

2020 ◽

pp. 321-358

Author(s):

Brian J. Toleno

Keyword(s):

Lead Free ◽

Electronic Assembly

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High Temperature Lead‐Free Bonding Materials – The Need, the Potential Candidates and the Challenges

Lead‐free Soldering Process Development and Reliability ◽

10.1002/9781119482093.ch6 ◽

2020 ◽

pp. 155-189

Author(s):

Hongwen Zhang ◽

Ning‐Cheng Lee

Keyword(s):

High Temperature ◽

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Low Temperature Lead‐Free Alloys and Solder Pastes

Lead‐free Soldering Process Development and Reliability ◽

10.1002/9781119482093.ch5 ◽

2020 ◽

pp. 95-154

Author(s):

Raiyo Aspandiar ◽

Nilesh Badwe ◽

Kevin Byrd

Keyword(s):

Low Temperature ◽

Lead Free ◽

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Lead‐Free Rework

Lead‐free Soldering Process Development and Reliability ◽

10.1002/9781119482093.ch3 ◽

2020 ◽

pp. 43-71

Author(s):

Jasbir Bath

Keyword(s):

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Lead ( Pb )‐Free Solders for High Reliability and High‐Performance Applications

Lead‐free Soldering Process Development and Reliability ◽

10.1002/9781119482093.ch7 ◽

2020 ◽

pp. 191-247

Author(s):

Richard J. Coyle

Keyword(s):

High Performance ◽

High Reliability

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Index

Lead‐free Soldering Process Development and Reliability ◽

10.1002/9781119482093.index ◽

2020 ◽

pp. 467-481

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PCB Laminates (Including High Speed Requirements)

Lead‐free Soldering Process Development and Reliability ◽

10.1002/9781119482093.ch9 ◽

2020 ◽

pp. 307-319

Author(s):

Karl Sauter ◽

Silvio Bertling

Keyword(s):

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