Lead‐free Soldering Process Development and Reliability
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Published By Wiley

9781119482031, 9781119482093
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Intermetallic Compounds

2020 ◽  
pp. 381-428
Author(s):  
Alyssa Yaeger ◽  
Travis Dale ◽  
Elizabeth McClamrock ◽  
Ganesh Subbarayan ◽  
Carol Handwerker
Keyword(s):  
Intermetallic Compounds

Solder Paste and Flux Technology

2020 ◽  
pp. 73-93
Author(s):  
Shantanu Joshi ◽  
Peter Borgesen
Keyword(s):  
Solder Paste

Conformal Coatings

2020 ◽  
pp. 429-465
Author(s):  
Jason Keeping
Keyword(s):  
Conformal Coatings

Low Temperature Lead‐Free Alloys and Solder Pastes

2020 ◽  
pp. 95-154
Author(s):  
Raiyo Aspandiar ◽  
Nilesh Badwe ◽  
Kevin Byrd
Keyword(s):  
Low Temperature ◽  
Lead Free ◽  
Solder Pastes

Lead‐Free Rework

2020 ◽  
pp. 43-71
Author(s):  
Jasbir Bath
Keyword(s):  
Lead Free

scholarly journals Index

2020 ◽  
pp. 467-481

PCB Laminates (Including High Speed Requirements)

2020 ◽  
pp. 307-319
Author(s):  
Karl Sauter ◽  
Silvio Bertling
Keyword(s):  
High Speed
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