Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
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Published By CRC Press

9780429215469

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Major International Lead (Pb)-Free Solder Studies

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies ◽

10.1201/9780203021484-22 ◽

2004 ◽

pp. 682-745

Keyword(s):

Free Solder

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Electrically Conductive Adhesives–A Lead-Free Alternative

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies ◽

10.1201/9780203021484-23 ◽

2004 ◽

pp. 746-785

Keyword(s):

Lead Free ◽

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives ◽

Free Alternative

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The Physics and Materials Science of Electromigration and Thermomigration in Solders

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies ◽

10.1201/9780203021484-25 ◽

2004 ◽

pp. 844-867

Keyword(s):

Materials Science

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Formation of Intermetallic Compounds at Pb-Sn/Metal and Lead- Free/Metal Interfaces in Solder Joints

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies ◽

10.1201/9780203021484-18 ◽

2004 ◽

pp. 482-511

Keyword(s):

Intermetallic Compounds ◽

Solder Joints ◽

Lead Free ◽

Metal Interfaces ◽

Free Metal

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Solder Wetting and Spreading

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies ◽

10.1201/9780203021484-16 ◽

2004 ◽

pp. 348-447

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Use of Inert Atmospheres in Lead-Free Soldering

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies ◽

10.1201/9780203021484-20 ◽

2004 ◽

pp. 586-607

Keyword(s):

Lead Free

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The Metallurgical Aspects, Properties, and Applications of Solders from the Lead–Tin System

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies ◽

10.1201/9780203021484-11 ◽

2004 ◽

pp. 184-227

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Reliability Aspects of Lead-Free Solders in Electronic Assemblies

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies ◽

10.1201/9780203021484-24 ◽

2004 ◽

pp. 786-843

Keyword(s):

Lead Free ◽

Lead Free Solders ◽

Electronic Assemblies

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Environmental Impact of Lead and Alternatives in Electronics

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies ◽

10.1201/9780203021484-8 ◽

2004 ◽

pp. 100-131

Keyword(s):

Environmental Impact

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Sn-Ag and Sn-Ag-X Solders and Properties

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies ◽

10.1201/9780203021484-13 ◽

2004 ◽

pp. 256-297

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Handbook of Lead-Free Solder Technology for Microelectronic AssembliesLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By CRC Press

Major International Lead (Pb)-Free Solder Studies

Electrically Conductive Adhesives–A Lead-Free Alternative

The Physics and Materials Science of Electromigration and Thermomigration in Solders

Formation of Intermetallic Compounds at Pb-Sn/Metal and Lead- Free/Metal Interfaces in Solder Joints

Solder Wetting and Spreading

Use of Inert Atmospheres in Lead-Free Soldering

The Metallurgical Aspects, Properties, and Applications of Solders from the Lead–Tin System

Reliability Aspects of Lead-Free Solders in Electronic Assemblies

Environmental Impact of Lead and Alternatives in Electronics

Sn-Ag and Sn-Ag-X Solders and Properties

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Latest Publications