2019 International 3D Systems Integration Conference (3DIC)
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75
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Published By IEEE

9781728148700
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

3D Test Wrapper Chain Optimization with I/O Cells Binding Considered

2019 ◽  
Author(s):  
Fan-Hsuan Tang ◽  
Hsu-Yu Kao ◽  
Shih-Hsu Huang ◽  
Jin-Fu Li
Keyword(s):  
Test Wrapper

Photoelectroscopic Study of Mn Barrier Layer on SiO2 for Si Wafer Bonding Process

2019 ◽  
Author(s):  
Takahiro Nagata ◽  
Kazumichi Tsumura ◽  
Kenro Nakamura ◽  
Kengo Uchida ◽  
Jin Kawakita ◽  
...  
Keyword(s):  
Barrier Layer ◽  
Wafer Bonding ◽  
Bonding Process ◽  
Si Wafer

Over-the-top Si Interposer Embedding Backside Buried Metal PDN to Reduce Power Supply Impedance of Large Scale Digital ICs

2019 ◽  
Author(s):  
Takuji Miki ◽  
Makoto Nagata ◽  
Akihiro Tsukioka ◽  
Noriyuki Miura ◽  
Takaaki Okidono ◽  
...  
Keyword(s):  
Power Supply ◽  
Large Scale ◽  
Over The Top

Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI

2019 ◽  
Author(s):  
Murugesan Mariappan ◽  
Mitsumasa Koyanagi ◽  
Takafumi Fukushima
Keyword(s):  
Layer Graphene ◽  
Growth Optimization

Study of Optimizing Stress-Strain Curve of Adhesive for High Expansion Tape

2019 ◽  
Author(s):  
Tadatomo Yamada ◽  
Ken Takano ◽  
Toshiaki Menjo ◽  
Shinya Takyu
Keyword(s):  
Strain Curve ◽  
Stress Strain Curve ◽  
Stress Strain

SiN used as a Stressor in Germanium-On-Insulator Substrate

2019 ◽  
Author(s):  
Sethavut Duangchan ◽  
Keisuke Yamamoto ◽  
Dong Wang ◽  
Hiroshi Nakashima ◽  
Akiyoshi Baba
Keyword(s):  
Insulator Substrate

Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction

2019 ◽  
Author(s):  
Makoto Motoyoshi ◽  
Koki Yanagimura ◽  
Taiko Fushimi ◽  
Shunta Endo
Keyword(s):  
Detector Technology

Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer

2019 ◽  
Author(s):  
Demin Liu ◽  
Po-Chih Chen ◽  
Yi-Chieh Tsai ◽  
Kuan-Neng Chen
Keyword(s):  
Low Temperature ◽  
Passivation Layer
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