2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)
Latest Publications

TOTAL DOCUMENTS

254

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780370384

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Studies on a novel flip-chip interconnect structure - pillar bump

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) ◽

10.1109/ectc.2001.927917 ◽

2005 ◽

Cited By ~ 1

Author(s):

Tie Wang ◽

F. Tung ◽

L. Foo ◽

V. Dutta

Keyword(s):

Flip Chip

Thermal characterization of plastic ball grid array packages via infrared thermography

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) ◽

10.1109/ectc.2001.928010 ◽

2002 ◽

Author(s):

L. Sweatlock ◽

D. Lischner ◽

J. Weiss

Keyword(s):

Infrared Thermography ◽

Ball Grid Array ◽

Thermal Characterization ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Packages

Evaluation and optimization of package processing, design, and reliability through solder joint profile prediction

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) ◽

10.1109/ectc.2001.927906 ◽

2002 ◽

Cited By ~ 1

Author(s):

B.H. Yeung ◽

T.-Y.T. Lee

Keyword(s):

Solder Joint

Optical fiber strain in epoxy-cured fiber optic connectors

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) ◽

10.1109/ectc.2001.928024 ◽

2002 ◽

Author(s):

K. Broadwater ◽

P.F. Mead

Keyword(s):

Optical Fiber ◽

Fiber Optic

Multi-channel optical interconnection modules up to 2.5 Gb/s/ch

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) ◽

10.1109/ectc.2001.927898 ◽

2002 ◽

Cited By ~ 3

Author(s):

J. Eichenberger ◽

S. Toyoda ◽

N. Takezawa ◽

C. Keller ◽

M. Sugiyama ◽

...

Keyword(s):

Optical Interconnection

Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) ◽

10.1109/ectc.2001.927920 ◽

2002 ◽

Author(s):

Se-Young Jang ◽

J. Wolf ◽

O. Ehrmann ◽

H. Gloor ◽

H. Reichl ◽

...

Development of thermoplastic isotropically conductive adhesive

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) ◽

10.1109/ectc.2001.927788 ◽

2002 ◽

Cited By ~ 13

Author(s):

S. Liong ◽

C.P. Wong

Keyword(s):

Conductive Adhesive ◽

Isotropically Conductive Adhesive

A study of normal, restoring, and fillet forces and solder bump geometry during reflow in concurrent underfill/reflow flip chip assembly

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) ◽

10.1109/ectc.2001.927809 ◽

2002 ◽

Cited By ~ 2

Author(s):

Renzhe Zhao ◽

Yun Zhang ◽

R.W. Johnson ◽

D.K. Harris

Keyword(s):

Flip Chip ◽

Solder Bump ◽

Flip Chip Assembly

Development of low cost, highly reliable CSP using gold-gold interconnection technology

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) ◽

10.1109/ectc.2001.927686 ◽

2002 ◽

Cited By ~ 3

Author(s):

S. Isozaki ◽

T. Kimura ◽

T. Shimada ◽

H. Nakajima

Keyword(s):

Low Cost

Studies on a novel flip-chip interconnect structure. Pillar bump

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) ◽

10.1109/ectc.2001.927911 ◽

2002 ◽

Cited By ~ 21

Author(s):

T. Wang ◽

F. Tung ◽

L. Foo ◽

V. Dutta

Keyword(s):

Flip Chip

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Studies on a novel flip-chip interconnect structure - pillar bump

Thermal characterization of plastic ball grid array packages via infrared thermography

Evaluation and optimization of package processing, design, and reliability through solder joint profile prediction

Optical fiber strain in epoxy-cured fiber optic connectors

Multi-channel optical interconnection modules up to 2.5 Gb/s/ch

Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder

Development of thermoplastic isotropically conductive adhesive

A study of normal, restoring, and fillet forces and solder bump geometry during reflow in concurrent underfill/reflow flip chip assembly

Development of low cost, highly reliable CSP using gold-gold interconnection technology

Studies on a novel flip-chip interconnect structure. Pillar bump

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)
Latest Publications