1992 Proceedings 42nd Electronic Components & Technology Conference
Latest Publications

TOTAL DOCUMENTS

167

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780301676

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Development of laser soldering process for a tape carrier package

1992 Proceedings 42nd Electronic Components & Technology Conference ◽

10.1109/ectc.1992.204183 ◽

2003 ◽

Cited By ~ 2

Author(s):

M. Namatame ◽

K. Murakami ◽

J. Hirota ◽

O. Hayashi ◽

S. Hoshinouchi

Keyword(s):

Soldering Process ◽

Laser Soldering

Download Full-text

A shape optimal design methodology for packaging design

1992 Proceedings 42nd Electronic Components & Technology Conference ◽

10.1109/ectc.1992.204289 ◽

2003 ◽

Author(s):

S.D. Rajan ◽

B. Nagaraj ◽

M. Mahalingam

Keyword(s):

Optimal Design ◽

Design Methodology ◽

Packaging Design

Download Full-text

Investigation of thermo-mechanically induced stress in a PQFP 160 using finite element techniques

1992 Proceedings 42nd Electronic Components & Technology Conference ◽

10.1109/ectc.1992.204247 ◽

2003 ◽

Cited By ~ 12

Author(s):

G. Kelly ◽

C. Lyden ◽

C. O'Mathuna ◽

J.S. Campbell

Keyword(s):

Finite Element ◽

Induced Stress

Download Full-text

Liquid dropping resin for IC encapsulant

1992 Proceedings 42nd Electronic Components & Technology Conference ◽

10.1109/ectc.1992.204332 ◽

2003 ◽

Cited By ~ 1

Author(s):

S. Ozawa ◽

M. Mizuno

Download Full-text

Zero-defect sputter deposition metallization method for high-volume manufacturing of grafted multilayer thin film modules

1992 Proceedings 42nd Electronic Components & Technology Conference ◽

10.1109/ectc.1992.204337 ◽

2003 ◽

Author(s):

T. Swirbel

Keyword(s):

Thin Film ◽

High Volume ◽

Sputter Deposition ◽

Multilayer Thin Film

Download Full-text

Au-Sn bonding metallurgy of TAB contacts and its influence on the Kirkendall effect in the ternary Cu-Au-Sn system

1992 Proceedings 42nd Electronic Components & Technology Conference ◽

10.1109/ectc.1992.204233 ◽

2003 ◽

Cited By ~ 8

Author(s):

E. Zakel ◽

H. Reichl

Keyword(s):

Kirkendall Effect

Download Full-text

Gold-to-aluminum bonding for TAB applications

1992 Proceedings 42nd Electronic Components & Technology Conference ◽

10.1109/ectc.1992.204309 ◽

2003 ◽

Author(s):

S.K. Kang

Download Full-text

Compatibility of common MCM-D dielectrics with scanning laser ablation-via generation processes

1992 Proceedings 42nd Electronic Components & Technology Conference ◽

10.1109/ectc.1992.204291 ◽

2003 ◽

Cited By ~ 4

Author(s):

T.G. Tessier ◽

G. Chandler

Keyword(s):

Laser Ablation ◽

Scanning Laser

Download Full-text

VLSI packaging requirements for new and evolving work stations

1992 Proceedings 42nd Electronic Components & Technology Conference ◽

10.1109/ectc.1992.204178 ◽

2003 ◽

Author(s):

H.L. Davidson

Download Full-text

Prediction and measurement of thermal conductivity of diamond filled adhesives

1992 Proceedings 42nd Electronic Components & Technology Conference ◽

10.1109/ectc.1992.204210 ◽

2003 ◽

Cited By ~ 2

Author(s):

J.C. Bolger

Keyword(s):

Thermal Conductivity

Download Full-text

1992 Proceedings 42nd Electronic Components & Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Development of laser soldering process for a tape carrier package

A shape optimal design methodology for packaging design

Investigation of thermo-mechanically induced stress in a PQFP 160 using finite element techniques

Liquid dropping resin for IC encapsulant

Zero-defect sputter deposition metallization method for high-volume manufacturing of grafted multilayer thin film modules

Au-Sn bonding metallurgy of TAB contacts and its influence on the Kirkendall effect in the ternary Cu-Au-Sn system

Gold-to-aluminum bonding for TAB applications

Compatibility of common MCM-D dielectrics with scanning laser ablation-via generation processes

VLSI packaging requirements for new and evolving work stations

Prediction and measurement of thermal conductivity of diamond filled adhesives

1992 Proceedings 42nd Electronic Components & Technology Conference
Latest Publications