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1992 Proceedings 42nd Electronic Components & Technology Conference
Latest Publications
TOTAL DOCUMENTS
167
(FIVE YEARS 0)
H-INDEX
11
(FIVE YEARS 0)
Published By IEEE
0780301676
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Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
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Gold-to-aluminum bonding for TAB applications
1992 Proceedings 42nd Electronic Components & Technology Conference
◽
10.1109/ectc.1992.204309
◽
2003
◽
Author(s):
S.K. Kang
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Compatibility of common MCM-D dielectrics with scanning laser ablation-via generation processes
1992 Proceedings 42nd Electronic Components & Technology Conference
◽
10.1109/ectc.1992.204291
◽
2003
◽
Cited By ~ 4
Author(s):
T.G. Tessier
◽
G. Chandler
Keyword(s):
Laser Ablation
◽
Scanning Laser
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VLSI packaging requirements for new and evolving work stations
1992 Proceedings 42nd Electronic Components & Technology Conference
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10.1109/ectc.1992.204178
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2003
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Author(s):
H.L. Davidson
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Prediction and measurement of thermal conductivity of diamond filled adhesives
1992 Proceedings 42nd Electronic Components & Technology Conference
◽
10.1109/ectc.1992.204210
◽
2003
◽
Cited By ~ 2
Author(s):
J.C. Bolger
Keyword(s):
Thermal Conductivity
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A shape optimal design methodology for packaging design
1992 Proceedings 42nd Electronic Components & Technology Conference
◽
10.1109/ectc.1992.204289
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2003
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Author(s):
S.D. Rajan
◽
B. Nagaraj
◽
M. Mahalingam
Keyword(s):
Optimal Design
◽
Design Methodology
◽
Packaging Design
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Investigation of thermo-mechanically induced stress in a PQFP 160 using finite element techniques
1992 Proceedings 42nd Electronic Components & Technology Conference
◽
10.1109/ectc.1992.204247
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2003
◽
Cited By ~ 12
Author(s):
G. Kelly
◽
C. Lyden
◽
C. O'Mathuna
◽
J.S. Campbell
Keyword(s):
Finite Element
◽
Induced Stress
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Liquid dropping resin for IC encapsulant
1992 Proceedings 42nd Electronic Components & Technology Conference
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10.1109/ectc.1992.204332
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2003
◽
Cited By ~ 1
Author(s):
S. Ozawa
◽
M. Mizuno
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Zero-defect sputter deposition metallization method for high-volume manufacturing of grafted multilayer thin film modules
1992 Proceedings 42nd Electronic Components & Technology Conference
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10.1109/ectc.1992.204337
◽
2003
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Author(s):
T. Swirbel
Keyword(s):
Thin Film
◽
High Volume
◽
Sputter Deposition
◽
Multilayer Thin Film
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Au-Sn bonding metallurgy of TAB contacts and its influence on the Kirkendall effect in the ternary Cu-Au-Sn system
1992 Proceedings 42nd Electronic Components & Technology Conference
◽
10.1109/ectc.1992.204233
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2003
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Cited By ~ 8
Author(s):
E. Zakel
◽
H. Reichl
Keyword(s):
Kirkendall Effect
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Development of laser soldering process for a tape carrier package
1992 Proceedings 42nd Electronic Components & Technology Conference
◽
10.1109/ectc.1992.204183
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2003
◽
Cited By ~ 2
Author(s):
M. Namatame
◽
K. Murakami
◽
J. Hirota
◽
O. Hayashi
◽
S. Hoshinouchi
Keyword(s):
Soldering Process
◽
Laser Soldering
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