Battery-type hollow Prussian blue analogues for asymmetric supercapacitor

Hollow/porous nanomaterials are widely applicable in various fields. The last years have witnessed increasing interests in the nanoscale Kirkendall effect as a versatile route to fabricate hollow/porous nanostructures. The transformation...

EVOLUTION OF INTERFACIAL MICROSTRUCTURE DURING RESISTANCE SPOT WELDING OF CU AND AL WITH AND NI-P COATING

Dissimilar materials of copper (Cu) to aluminum (Al) with nickel-phosphorus (Ni-P) coatings were joined using resistance spot welding. The Ni-P coatings were electroless plated on the Al surfaces to eliminate the formation of brittle Cu-Al intermetallic compounds (IMCs) at the faying interface of Cu to Al. Three welding schedules with various heat input were employed to produce different interfacial microstructure. The evolution of interfaces in terms of phase constitution, elemental distribution and defects (gaps and voids) was characterized and the formation mechanisms were elucidated. During the welding, the bonding between Cu and Ni-P form through solid-state diffusion, while the faster diffusion rate of Cu relative to Ni and P atoms promotes the generation of sub-micro voids. As the heat input increases, gaps at the Cu/Ni-P interface diminishes accompanied by increase of sub-micro voids. A moderate schedule helps to remove the gaps and inhibit the voids formation. An Al3Ni layer and nanovoids were found around the interface of Ni-P/Al. The increased heat input decreases the grain size of Al3Ni at the interface by eutectic remelting and increases the nanovoids by enhanced nanoscale Kirkendall effect.

Evolution of Interfacial Microstructure During Resistance Spot Welding of Cu and Al With Ni-P Coating

Dissimilar materials of copper (Cu) to aluminum (Al) with nickel-phosphorus (Ni-P) coatings were joined using resistance spot welding. The Ni-P coatings were electroless plated on the Al surfaces to eliminate the formation of brittle Cu-Al intermetallic compounds (IMCs) at the faying interface between Cu and Al. Three welding schedules with various heat input were employed to produce different interfacial microstructure. The evolution of interfaces in terms of phase constitution, elemental distribution and defects (gaps and voids) was characterized and the formation mechanisms were elucidated. During the welding process, the bonding between Cu and Ni-P forms through solid-state diffusion, while the faster diffusion rate of Cu relative to Ni and P atoms promotes the generation of sub-micron voids. As the heat input increases, gaps at the Cu/Ni-P interface diminish accompanied by increase of sub-micron voids. A moderate schedule helps to remove the gaps and inhibits the void formation. An Al3Ni layer and nanovoids were found around the interface of Ni-P/Al. The increased heat input decreases the grain size of Al3Ni at the interface by eutectic remelting and increases the nanovoids by enhanced nanoscale Kirkendall effect.