2020 International Wafer Level Packaging Conference (IWLPC)
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42
(FIVE YEARS 42)

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Published By IEEE

9781944543167
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Die to Wafer Hybrid Bonding: Multi-Die Stacking with Tsv Integration

2020 ◽  
Author(s):  
Guilian Gao ◽  
Jeremy Theil ◽  
Gill Fountain ◽  
Thomas Workman ◽  
Gabe Guevara ◽  
...  
Keyword(s):  
Die Stacking

Handling of Different FOPLP Layouts on Large Area Thermal Chucks

2020 ◽  
Author(s):  
Debbie Claire Sanchez ◽  
Klemens Reitinger ◽  
Sophia Oldeide ◽  
Wenxuan Song
Keyword(s):  
Large Area

Board Level Reliability of Automotive Grade WLCSP for Radar Applications

2020 ◽  
Author(s):  
Nishant Lakhera ◽  
Burt Carpenter ◽  
Trung Duong ◽  
Mollie Benson ◽  
Andrew J Mawer
Keyword(s):  
Radar Applications ◽  
Board Level ◽  
Board Level Reliability

Maskless Lithography Optimized for Heterogeneous and Chiplet Integration

2020 ◽  
Author(s):  
B. Matuskova ◽  
B. Povazay ◽  
R. Holly ◽  
F. Bogelsack ◽  
T. Zenger ◽  
...  
Keyword(s):  
Maskless Lithography
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