Journal of SHM
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236
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3
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Published By Japan Institute Of Electronics Packaging

1884-1198, 0919-4398
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scholarly journals Report of the 7th. Microelectronics Symposium.

1998 ◽  
Vol 14 (1) ◽  
pp. 32-38 ◽  
Author(s):  
Hideo Takamizawa

scholarly journals Roport of SHM Kansai Workshop'97

1998 ◽  
Vol 14 (1) ◽  
pp. 41-41
Author(s):  
Yuzo Katayama

scholarly journals Packaging Technologies of System LSI.

1998 ◽  
Vol 14 (2) ◽  
pp. 38-43
Author(s):  
Tomoaki Hashimoto ◽  
Toshiaki Shinohara

scholarly journals Flip Chip Assembly for Smart Card Manufactueing.

1998 ◽  
Vol 14 (2) ◽  
pp. 33-37
Author(s):  
Minoru Wada
Keyword(s):  
Smart Card ◽  
Flip Chip ◽  
Flip Chip Assembly

scholarly journals Multilayer Chip Impedor.

1998 ◽  
Vol 14 (1) ◽  
pp. 22-28
Author(s):  
Gen Daigaku ◽  
Hiroyuki Wada ◽  
Kazuhito Sakamoto

scholarly journals New Technology for Thin Type Contactless IC Card.

1998 ◽  
Vol 14 (2) ◽  
pp. 28-32
Author(s):  
Mitsuo Usami
Keyword(s):  
New Technology ◽  
Ic Card ◽  
Contactless Ic Card

scholarly journals Packaging Technology for System LSI.

1998 ◽  
Vol 14 (1) ◽  
pp. 11-15
Author(s):  
Jun-ichi Ohno ◽  
Ryoji Homma
Keyword(s):  
Packaging Technology

scholarly journals MCM Mass-Production Technology by Flip Chip Mounting for Super Small Visual Radio.

1998 ◽  
Vol 14 (2) ◽  
pp. 22-27
Author(s):  
Hidenori Kuwata ◽  
Yoshihiko Yagi
Keyword(s):  
Production Technology ◽  
Mass Production ◽  
Flip Chip
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