2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)
Latest Publications

TOTAL DOCUMENTS

164

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781479969944

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Analysis of silicone-based adhesive bond separation

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2014.7028346 ◽

2014 ◽

Author(s):

L. E. Khoong ◽

T. K. Gan ◽

M. B. Young

Keyword(s):

Adhesive Bond

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Study of transmission line performance on through silicon interposer

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2014.7028371 ◽

2014 ◽

Cited By ~ 5

Author(s):

Ka Fai Chang ◽

Rui Li ◽

Liang Ding ◽

Songbai Zhang

Keyword(s):

Transmission Line

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Advanced electrical array interconnections for ultrasound probes integrated in surgical needles

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2014.7028266 ◽

2014 ◽

Cited By ~ 2

Author(s):

Giuseppe Schiavone ◽

Thomas Jones ◽

Dennis Price ◽

Rachael McPhillips ◽

Zhen Qiu ◽

...

Keyword(s):

Ultrasound Probes

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Sensor-enabled PCBs to aid right first time manufacture through defect prediction

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2014.7028396 ◽

2014 ◽

Author(s):

Richard Sharpe ◽

Guy Banwell ◽

Paul P. Conway ◽

Andrew A. West

Keyword(s):

Defect Prediction ◽

First Time

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Manufacturability readiness of insulated Cu wire bonding process in PBGA package

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2014.7028288 ◽

2014 ◽

Author(s):

Leong HungYang ◽

Yap BoonKar ◽

Tan Chou Yong ◽

Navas Khan ◽

Mohd Rusli Ibrahim ◽

...

Keyword(s):

Wire Bonding ◽

Bonding Process

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Stochastic wire-length model with TSV placement on periphery area

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2014.7028291 ◽

2014 ◽

Author(s):

Jianhui Ling ◽

Huiyun Li ◽

Guoqing Xu ◽

Liying Xiong

Keyword(s):

Wire Length

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Package-level Si-based micro-jet impingement cooling solution with multiple drainage micro-trenches

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2014.7028284 ◽

2014 ◽

Cited By ~ 14

Author(s):

Yong Han ◽

Boon Long Lau ◽

Hengyun Zhang ◽

Xiaowu Zhang

Keyword(s):

Jet Impingement ◽

Impingement Cooling

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Evaluating the optimal location for embedded accelerometers using experimentally validated computer algorithms

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2014.7028395 ◽

2014 ◽

Author(s):

Guy Banwell ◽

Richard Sharpe ◽

Paul Conway ◽

Andrew West

Keyword(s):

Optimal Location ◽

Computer Algorithms

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Intermetallic compound growth mechanism and failure modes of flip chip solder bump with different UBM structure during electromigration

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2014.7028311 ◽

2014 ◽

Cited By ~ 1

Author(s):

Yong-Sheng Zou ◽

Yu-Hsiang Hsiao ◽

Kwang-Lung Lin

Keyword(s):

Intermetallic Compound ◽

Growth Mechanism ◽

Flip Chip ◽

Failure Modes ◽

Solder Bump ◽

Intermetallic Compound Growth

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Electrical performance of isotropic conductive adhesives with copper and copper coated iron fillers

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2014.7028407 ◽

2014 ◽

Author(s):

Junpeng Liu ◽

Richard Redei ◽

Siyuan Qi ◽

David A. Hutt ◽

David Whalley

Keyword(s):

Electrical Performance ◽

Conductive Adhesives ◽

Isotropic Conductive Adhesives

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2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Analysis of silicone-based adhesive bond separation

Study of transmission line performance on through silicon interposer

Advanced electrical array interconnections for ultrasound probes integrated in surgical needles

Sensor-enabled PCBs to aid right first time manufacture through defect prediction

Manufacturability readiness of insulated Cu wire bonding process in PBGA package

Stochastic wire-length model with TSV placement on periphery area

Package-level Si-based micro-jet impingement cooling solution with multiple drainage micro-trenches

Evaluating the optimal location for embedded accelerometers using experimentally validated computer algorithms

Intermetallic compound growth mechanism and failure modes of flip chip solder bump with different UBM structure during electromigration

Electrical performance of isotropic conductive adhesives with copper and copper coated iron fillers

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)
Latest Publications