2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)
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9781479969944
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Analysis of silicone-based adhesive bond separation

2014 ◽  
Author(s):  
L. E. Khoong ◽  
T. K. Gan ◽  
M. B. Young
Keyword(s):  
Adhesive Bond

Study of transmission line performance on through silicon interposer

2014 ◽  
Author(s):  
Ka Fai Chang ◽  
Rui Li ◽  
Liang Ding ◽  
Songbai Zhang
Keyword(s):  
Transmission Line

Advanced electrical array interconnections for ultrasound probes integrated in surgical needles

2014 ◽  
Author(s):  
Giuseppe Schiavone ◽  
Thomas Jones ◽  
Dennis Price ◽  
Rachael McPhillips ◽  
Zhen Qiu ◽  
...  
Keyword(s):  
Ultrasound Probes

scholarly journals Sensor-enabled PCBs to aid right first time manufacture through defect prediction

2014 ◽  
Author(s):  
Richard Sharpe ◽  
Guy Banwell ◽  
Paul P. Conway ◽  
Andrew A. West
Keyword(s):  
Defect Prediction ◽  
First Time

Manufacturability readiness of insulated Cu wire bonding process in PBGA package

2014 ◽  
Author(s):  
Leong HungYang ◽  
Yap BoonKar ◽  
Tan Chou Yong ◽  
Navas Khan ◽  
Mohd Rusli Ibrahim ◽  
...  
Keyword(s):  
Wire Bonding ◽  
Bonding Process

Stochastic wire-length model with TSV placement on periphery area

2014 ◽  
Author(s):  
Jianhui Ling ◽  
Huiyun Li ◽  
Guoqing Xu ◽  
Liying Xiong
Keyword(s):  
Wire Length

Electrical performance of isotropic conductive adhesives with copper and copper coated iron fillers

2014 ◽  
Author(s):  
Junpeng Liu ◽  
Richard Redei ◽  
Siyuan Qi ◽  
David A. Hutt ◽  
David Whalley
Keyword(s):  
Electrical Performance ◽  
Conductive Adhesives ◽  
Isotropic Conductive Adhesives
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