Microelectronic Interconnections and Assembly
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Published By Springer Netherlands

9789401061599, 9789401151351
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

The At-Temperature Mechanical Properties of Lead-Tin Based Alloys

1998 ◽  
pp. 53-58
Author(s):  
W. Kinzy Jones ◽  
Y. Q. Liu ◽  
Marc A. Zampino ◽  
Gerardo L. Gonzalez
Keyword(s):  
Mechanical Properties

Low Cost Interconnection Technology for Fast Prototyping of Multichip Modules

1998 ◽  
pp. 109-117 ◽  
Author(s):  
Zsolt Illyefalvi-Vitéz ◽  
János Pinkola ◽  
László Gál ◽  
Endre Tóth
Keyword(s):  
Low Cost ◽  
Multichip Modules ◽  
Fast Prototyping

Solder and Solderless Flip Chip Assembly on a MCM-D in a BGA Package

1998 ◽  
pp. 79-79
Author(s):  
Peter Bodo ◽  
Hans Hentzell ◽  
Jan Strandberg ◽  
Joacim Haglund ◽  
Sima Valizadeh
Keyword(s):  
Flip Chip ◽  
Bga Package ◽  
Flip Chip Assembly

On Thin Film MCM-D Interconnects

1998 ◽  
pp. 141-144
Author(s):  
J. Roggen ◽  
E. Beyne ◽  
C. Truzzi ◽  
E. Ringoot ◽  
P. Pieters
Keyword(s):  
Thin Film
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