Design and Implementation of Jtag Compatible 4-Bit Multiplier

The novel scan- based methodology was developed and resulted in system designers agreeing on it due to the rising complication of boards and also enhancement of technologies like multichip modules. It is called as boundary scan testing for the board level chips. This method was established by the Joint Test Access Group. It was named as JTAG. JTAG was developed for verifying designs and testing printed circuit boards after manufacture. A JTAG interface is a special interface added to a chip. Traditional test technologies require very large and expensive equipment. The most aim of this paper is to style and implement 4-bit multiplier using this standard. The designs were being verified and the circuit boards were being tested after the manufacture by using the industry standard JTAG. It is employed because of accessing sub-blocks of chips. It's a very important mechanism for debugging embedded systems. Boundary-scan cells created exploitation electronic device and latch circuits square measure hooked up to each pin on the device. These cells, embedded among the device, will capture knowledge from pin or core logic signals conjointly as force knowledge onto pins. Captured knowledge is serially shifted out through the JTAG take a look at Access Port (TAP) and will be compared to expected values to figure out a pass or fail result. Forced take a look at knowledge is serially shifted into the boundary-scan cells.

Re-Packaging Solution of Bare Dice From Customer Packages To Open-Cavity Ceramic Packages

The advent of bare die form in the semiconductor industry driven by the high-performance multichip modules’ (MCM) requirement posed electrical access and testing challenges on customer returned units (CRUs) for failure analysis (FA). In this technical literature, the developed die extraction processes and re-packaging solution on molded MCM and flex package types were discussed.

LiDAR Packaging

The rising demand for the “eyes to the machine” or 3D point cloud images in a wide set of application areas, such as automotive, trucking, UAV/drones, industrial, mapping, military and defense, surveillance, and others, is expected to exponentially drive the LiDAR market over the next two decades. The massive automotive LiDAR market is at its nascence stage. Wallstreet Research projects a $2 billion market by 2020 and grow to a staggering $82B by 2035. The Total Available Market (TAM) of LiDAR sensors is expected to grow from hundreds of thousands to millions and hundreds of millions through this period. With the market growth in demand and application specific requirements, the design, manufacturing and proxy of performance must revolutionize to deliver performance, quality, reliability, scale and cost. LiDAR optical design, integration, and miniaturization require novel packaging solutions, process and advanced tool development and hands-on lessons. Packaging and validation of performance requires a multidisciplinary approach that spans across the optical, electrical, mechanical and computer science domains. Although LiDAR has been around since the 1960s, the industry is beginning to learn the challenges in semiconductor packaging, interconnect substrate technologies, optoelectronic module technology, inter-assembly, and manufacturing multichip modules to meet the needs of the autonomous machine market.

Multilayer thick-film ceramic for multichip modules with laser microvias

Purpose The purpose of the paper is to show up the current possibilities by combination of classic thick-film technology with advanced processing. Thick-film hybrid ceramic substrates have been a base for highly reliable devices for space, aerospace, medical and industrial applications since many years. The combination of classic thick-film printing with advanced technologies for fine line structuring provides substrates best suited for packaging solutions with challenging requirements, such as temperature stability and extended product lifetime. Combined with state of the art assembly technologies, thick-film substrates are used in highly demanding industries. Design/methodology/approach In recent years, several technologies for fine line structuring have been introduced, e.g. fine line printing, photo imaging, etching, laser structuring for local chip fan-out or fine line structuring on single layers. For further miniaturization of thick-film multilayers circuits, after solving the fine line resolution, the reduction of electrical connection of conductive layers through printed insulation/dielectric layer (via) diameters to connect the layers should be addressed. Findings The focus of this paper is to show the results of combining fine line structuring with laser microvias and to compare laser drilling in thick-films with different established via forming technologies. Originality/value The reduction of via size to 60 µm – smaller than 50% compared to using state-of-the-art printing technologies enables a solution for significant relaxation of current design possibilities.