Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205)

2002 ◽

Cited By ~ 1

Author(s):

G. Di Giacomo ◽

L. Li

Keyword(s):

Reliability Model ◽

Fatigue Reliability ◽

Solder Interconnects

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Qualification of the tape-and-reel packing system ensures quality to the customer

Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205) ◽

10.1109/iemt.1998.731044 ◽

2002 ◽

Cited By ~ 1

Author(s):

R.E. Truesdale ◽

D.W. Brashear ◽

T.G. Hicks

Keyword(s):

Packing System

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Solderability testing in nitrogen atmosphere of plasma treated HASL finish PCBs for fluxless soldering

Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205) ◽

10.1109/iemt.1998.731073 ◽

2002 ◽

Cited By ~ 9

Author(s):

G. Takyi ◽

N.N. Ekere ◽

J.D. Philpott ◽

K.G. Snowdon ◽

C.G. Tanner

Keyword(s):

Nitrogen Atmosphere ◽

Fluxless Soldering

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The reliability improvement on self-aligned contact CMOS by optimizing poly etching

Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205) ◽

10.1109/iemt.1998.731067 ◽

2002 ◽

Cited By ~ 1

Author(s):

C.-D. Chang ◽

C.-Y. Chu ◽

D.-E. Lin

Keyword(s):

Reliability Improvement

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Study of arsenic out-diffusion for buried plate formation in trench capacitors

Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205) ◽

10.1109/iemt.1998.731168 ◽

2002 ◽

Author(s):

L. Economikos ◽

C.S. Murthy ◽

R.W. Young

Keyword(s):

Plate Formation

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Investigation of the correlation of peel strength and pad adhesion measurements using different printed circuit board base materials

Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205) ◽

10.1109/iemt.1998.731025 ◽

2002 ◽

Cited By ~ 1

Author(s):

S. Mueller

Keyword(s):

Printed Circuit Board ◽

Peel Strength ◽

Circuit Board ◽

Printed Circuit ◽

Base Materials

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Failure modes & effects analysis (FMEA) of flip chip devices attached to printed wiring boards (PWB)

Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205) ◽

10.1109/iemt.1998.731080 ◽

2002 ◽

Cited By ~ 2

Author(s):

M. Kennedy

Keyword(s):

Flip Chip ◽

Failure Modes ◽

Printed Wiring Boards

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Implications of EPA's Risk Management Program to semiconductor manufacturers

Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205) ◽

10.1109/iemt.1998.731086 ◽

2002 ◽

Author(s):

B.J. Davis ◽

C. Nauert

Keyword(s):

Risk Management ◽

Management Program ◽

Risk Management Program

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Reduction of the energy in a notebook computer using lifecycle analysis and design for environment methodologies

Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205) ◽

10.1109/iemt.1998.731082 ◽

2002 ◽

Author(s):

J. Janert ◽

K. Lo ◽

C. White

Keyword(s):

Design For Environment ◽

Lifecycle Analysis ◽

Analysis And Design ◽

Notebook Computer

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Stabilization of alumina slurries in presence of oxidizers for tungsten chemical mechanical polishing

Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205) ◽

10.1109/iemt.1998.731071 ◽

2002 ◽

Cited By ~ 1

Author(s):

B.J. Palla ◽

D.O. Shah ◽

M. Bielmann ◽

R.K. Singh

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing

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Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Fatigue reliability model of solder interconnects for first and second-level packaging

Qualification of the tape-and-reel packing system ensures quality to the customer

Solderability testing in nitrogen atmosphere of plasma treated HASL finish PCBs for fluxless soldering

The reliability improvement on self-aligned contact CMOS by optimizing poly etching

Study of arsenic out-diffusion for buried plate formation in trench capacitors

Investigation of the correlation of peel strength and pad adhesion measurements using different printed circuit board base materials

Failure modes & effects analysis (FMEA) of flip chip devices attached to printed wiring boards (PWB)

Implications of EPA's Risk Management Program to semiconductor manufacturers

Reduction of the energy in a notebook computer using lifecycle analysis and design for environment methodologies

Stabilization of alumina slurries in presence of oxidizers for tungsten chemical mechanical polishing

Export Citation Format

Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Fatigue reliability model of solder interconnects for first and second-level packaging

Qualification of the tape-and-reel packing system ensures quality to the customer

Solderability testing in nitrogen atmosphere of plasma treated HASL finish PCBs for fluxless soldering

The reliability improvement on self-aligned contact CMOS by optimizing poly etching

Study of arsenic out-diffusion for buried plate formation in trench capacitors

Investigation of the correlation of peel strength and pad adhesion measurements using different printed circuit board base materials

Failure modes & effects analysis (FMEA) of flip chip devices attached to printed wiring boards (PWB)

Implications of EPA's Risk Management Program to semiconductor manufacturers

Reduction of the energy in a notebook computer using lifecycle analysis and design for environment methodologies

Stabilization of alumina slurries in presence of oxidizers for tungsten chemical mechanical polishing

Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205)
Latest Publications