Handbook of 3D Integration
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Published By Wiley-VCH Verlag Gmbh & Co. Kgaa

9783527623051, 9783527320349
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Lincoln Laboratory's 3D Circuit Integration Technology

2008 ◽  
pp. 393-411
Author(s):  
James Burns ◽  
Brian Aull ◽  
Robert Berger ◽  
Nisha Checka ◽  
Chang‐Lee Chen ◽  
...  
Keyword(s):  
Integration Technology ◽  
Circuit Integration

Drivers for 3D Integration

2008 ◽  
pp. 13-24 ◽  
Author(s):  
Philip Garrou ◽  
Susan Vitkavage ◽  
Sitaram Arkalgud
Keyword(s):  
3D Integration

Interconnect Process at the University of Arkansas

2008 ◽  
pp. 319-337
Author(s):  
Susan Burkett ◽  
Leonard Schaper
Keyword(s):  
University Of Arkansas ◽  
The University

Polymer Adhesive Bonding Technology

2008 ◽  
pp. 249-259 ◽  
Author(s):  
James Jian‐Qiang Lu ◽  
Tim S. Cale ◽  
Ronald J. Gutmann
Keyword(s):  
Adhesive Bonding ◽  
Polymer Adhesive ◽  
Bonding Technology

Copper Plating

2008 ◽  
pp. 133-156
Author(s):  
Tom Ritzdorf ◽  
Rozalia Beica ◽  
Charles Sharbono
Keyword(s):  
Copper Plating

3D Memories

2008 ◽  
pp. 675-688
Author(s):  
Mark Tuttle

Fabrication Using Copper Thermo‐Compression Bonding at MIT

2008 ◽  
pp. 431-446
Author(s):  
Chuan Seng Tan ◽  
Andy Fan ◽  
Rafael Reif

SiO 2

2008 ◽  
pp. 107-120 ◽  
Author(s):  
Robert Wieland

scholarly journals Front Matter

2008 ◽  
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