2008 IEEE-EPEP Electrical Performance of Electronic Packaging
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424428731

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Development of a cost-reduced package thru DOE validation and zero-margin design concept

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675900 ◽

2008 ◽

Author(s):

Jackson Kong ◽

Jimmy Huang ◽

Wan Ching Quah ◽

Teong Keat Beh

Keyword(s):

Design Concept

Download Full-text

Robust iterative finite element solver for multi-terminal power distribution network resistance extraction

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675908 ◽

2008 ◽

Cited By ~ 5

Author(s):

Martien Oppeneer ◽

Prasad Sumant ◽

Andreas C. Cangellaris

Keyword(s):

Finite Element ◽

Power Distribution ◽

Distribution Network ◽

Power Distribution Network

Download Full-text

A novel stopband-enhanced EBG planes using an Embedded Slow-wave Structure in Low-cost RF-SiP

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675895 ◽

2008 ◽

Cited By ~ 2

Author(s):

Chia-Yuan Hsieh ◽

Hao-Hsiang Chuang ◽

Ting-Kuang Wang ◽

Chen-Chao Wang ◽

Hung-Hsiang Cheng ◽

...

Keyword(s):

Slow Wave ◽

Low Cost ◽

Wave Structure ◽

Slow Wave Structure

Download Full-text

2008 IEEE electrical performance of electronic packaging suppression of vertical coupling using Electromagnetic Band Gap structures

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675906 ◽

2008 ◽

Cited By ~ 3

Author(s):

Nithya Sankaran ◽

Suzanne Huh ◽

Madhavan Swaminathan ◽

Rao Tummala

Keyword(s):

Band Gap ◽

Electronic Packaging ◽

Electrical Performance ◽

Electromagnetic Band Gap ◽

Vertical Coupling

Download Full-text

Controlled impedance chip-to-chip interconnect using coplanar wire bond structures

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675931 ◽

2008 ◽

Cited By ~ 5

Author(s):

Samuel Harkness ◽

Jeffrey Meirhofer ◽

Brock J. LaMeres

Keyword(s):

Wire Bond

Download Full-text

Parallel full-chip transient simulation at transistor level

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675924 ◽

2008 ◽

Cited By ~ 1

Author(s):

He Peng ◽

Khosro Rouz ◽

Manjit Borah ◽

Chung-Kuan Cheng

Keyword(s):

Transient Simulation

Download Full-text

Design and analysis of a TB/sec memory system

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675866 ◽

2008 ◽

Cited By ~ 5

Author(s):

Wendemagegnehu T. Beyene ◽

Chris Madden ◽

Namhoon Kim ◽

Hae-Chang Lee ◽

Rich Perego ◽

...

Keyword(s):

Memory System

Download Full-text

An efficient inductance extraction algorithm for 3-D interconnects with frequency dependent nonlinear magnetic materials

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675918 ◽

2008 ◽

Cited By ~ 1

Author(s):

Yang Yi ◽

Vivek Sarin ◽

Weiping Shi

Keyword(s):

Magnetic Materials ◽

Frequency Dependent ◽

Inductance Extraction ◽

Extraction Algorithm

Download Full-text

Compact expressions for period jitter of global binary clock trees

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675873 ◽

2008 ◽

Cited By ~ 3

Author(s):

Jinwook Jang ◽

Olivier Franza ◽

Wayne Burleson

Download Full-text

Analysis of EBG structures using SPICE models of multiple planes

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675890 ◽

2008 ◽

Cited By ~ 1

Author(s):

Naoki Kobayashi ◽

Ken Morishita ◽

Takashi Harada

Download Full-text

2008 IEEE-EPEP Electrical Performance of Electronic PackagingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Development of a cost-reduced package thru DOE validation and zero-margin design concept

Robust iterative finite element solver for multi-terminal power distribution network resistance extraction

A novel stopband-enhanced EBG planes using an Embedded Slow-wave Structure in Low-cost RF-SiP

2008 IEEE electrical performance of electronic packaging suppression of vertical coupling using Electromagnetic Band Gap structures

Controlled impedance chip-to-chip interconnect using coplanar wire bond structures

Parallel full-chip transient simulation at transistor level

Design and analysis of a TB/sec memory system

An efficient inductance extraction algorithm for 3-D interconnects with frequency dependent nonlinear magnetic materials

Compact expressions for period jitter of global binary clock trees

Analysis of EBG structures using SPICE models of multiple planes

2008 IEEE-EPEP Electrical Performance of Electronic Packaging
Latest Publications