2008 IEEE-EPEP Electrical Performance of Electronic Packaging
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98

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9

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Published By IEEE

9781424428731

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

2008 IEEE electrical performance of electronic packaging suppression of vertical coupling using Electromagnetic Band Gap structures

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675906 ◽

2008 ◽

Author(s):

Nithya Sankaran ◽

Suzanne Huh ◽

Madhavan Swaminathan ◽

Rao Tummala

Keyword(s):

Band Gap ◽

Electronic Packaging ◽

Electrical Performance ◽

Electromagnetic Band Gap ◽

Vertical Coupling

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Controlled impedance chip-to-chip interconnect using coplanar wire bond structures

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675931 ◽

2008 ◽

Author(s):

Samuel Harkness ◽

Jeffrey Meirhofer ◽

Brock J. LaMeres

Keyword(s):

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Parallel full-chip transient simulation at transistor level

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675924 ◽

2008 ◽

Author(s):

He Peng ◽

Khosro Rouz ◽

Manjit Borah ◽

Chung-Kuan Cheng

Keyword(s):

Transient Simulation

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A novel stopband-enhanced EBG planes using an Embedded Slow-wave Structure in Low-cost RF-SiP

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675895 ◽

2008 ◽

Author(s):

Chia-Yuan Hsieh ◽

Hao-Hsiang Chuang ◽

Ting-Kuang Wang ◽

Chen-Chao Wang ◽

Hung-Hsiang Cheng ◽

...

Keyword(s):

Slow Wave ◽

Low Cost ◽

Wave Structure ◽

Slow Wave Structure

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Development of a cost-reduced package thru DOE validation and zero-margin design concept

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675900 ◽

2008 ◽

Author(s):

Jackson Kong ◽

Jimmy Huang ◽

Wan Ching Quah ◽

Teong Keat Beh

Keyword(s):

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Robust iterative finite element solver for multi-terminal power distribution network resistance extraction

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675908 ◽

2008 ◽

Author(s):

Martien Oppeneer ◽

Prasad Sumant ◽

Andreas C. Cangellaris

Keyword(s):

Finite Element ◽

Power Distribution ◽

Distribution Network ◽

Power Distribution Network

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Designs of signal-ground bump-patterns for minimizing the simultaneous switching noise in a ball grid array

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675864 ◽

2008 ◽

Author(s):

Ruey-Bo Sun ◽

Chien-Min Lin ◽

Ruey-Beei Wu

Keyword(s):

Ball Grid Array ◽

Switching Noise ◽

Simultaneous Switching Noise ◽

Simultaneous Switching

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Design and analysis of a TB/sec memory system

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675866 ◽

2008 ◽

Author(s):

Wendemagegnehu T. Beyene ◽

Chris Madden ◽

Namhoon Kim ◽

Hae-Chang Lee ◽

Rich Perego ◽

...

Keyword(s):

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An efficient inductance extraction algorithm for 3-D interconnects with frequency dependent nonlinear magnetic materials

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675918 ◽

2008 ◽

Author(s):

Yang Yi ◽

Vivek Sarin ◽

Weiping Shi

Keyword(s):

Magnetic Materials ◽

Frequency Dependent ◽

Inductance Extraction ◽

Extraction Algorithm

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Compact expressions for period jitter of global binary clock trees

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675873 ◽

2008 ◽

Author(s):

Jinwook Jang ◽

Olivier Franza ◽

Wayne Burleson

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