High-Frequency Non-Invasive Magnetic Field-Based Condition Monitoring of SiC Power MOSFET Modules

Current distribution anomaly can be used to indicate the onset of package-related failures modes in Silicon Carbide power MOSFET modules. In this paper, we propose to obtain the wire bond’s magnetic field profile using an array of Tunnel Magneto-Resistance (TMR) sensors, and characterise the small changes in the current density distribution to find the onset of the wire bond degradation processes, including wire bond lift-off, wire bond cracking, and wire bond fracture. We propose a novel condition monitoring technique where a non-galvanic high-bandwidth sensing and a reliability model monitor the health of the power switches. We designed a dedicated calibration set-up to examine the sensor array and calibrated to demonstrate the adequate sensitivity to a minimum 5% current anomaly detection in a single wire bond of the switching devices operating with 50 kHz switching frequency. We use a hardware-in-the-loop (HIL) experimental set-up to replicate wire bond-related failures in a 1200V/55A SiC MOSFET power module of a DC/DC Boost converter. Signal conditioning circuits are further designed to amplify and buffer the sensor readings. Experimental results showed the proposed technique is able to detect a wide range of package-related failures.

Desain Sistem Functional Test RFID Chips Array untuk Proses Manufaktur Smart Card pada TFME Politeknik Negeri Batam

Proses pengembangan dan produksi smart card dilakukan pada Teaching Factory Manufacturing of Electronics (TFME) Politeknik Negeri Batam. Pada proses produksi smart card perlu dikembangkan sistem pengujian sample untuk memastikan hasil wiring dan proses die attach berhasil yang ditandai dengan komunikasi antara chip dan RFID reader (13,56 MHz). Pendekatan yang dilakukan adalah merancang sistem uji fungsi RFID otomatis dengan memanfaatkan pergerakan tiga axis dan mini probe yang melekat pada pad sambungan wire bond dan die. Metode yang digunakan pada penelitian ini terdiri dari perancangan mekanik, perancangan elektrik, perancangan perangkat lunak, dan pengujian sistem. Resistansi probe RFID memiliki resistansi 1,8 Ohm. Pergerakan setiap axis menggunakan motor stepper yang dikopling dengan ulir linear T8 2pitch 4star. Torsi yang terukur pada axis x, y, dan z adalah 4.64 N.mm, 59,54 N.mm, dan 10,72 N.mm pada saat stepper bergerak maju.

ГИБРИДНАЯ ТЕХНОЛОГИЯ ПРОИЗВОДСТВА МНОГОКРИСТАЛЬНЫХ СИСТЕМ В КОРПУСЕ С ОДНОВРЕМЕННЫМ ПРИМЕНЕНИЕМ ТЕХНОЛОГИЙ FLIP-CHIP И WIRE BOND

Рассмотрена гибридная технология производства микросборок с одновременным применением технологий Flip-Chip и Wire Bond, отрабатываемая на предприятии индустриального партнера GS Nanotech. Описаны особенности основных технологических операций и методов контроля качества на каждом этапе производства.

Reliability Assessment of Cu-Al WB Under High Temperature and High Voltage Bias Application

Electronics in automotive underhood environments may be subjected to high temperature in the range of 125–200°C. Transition to electric vehicles has resulted in need for electronics capable of operation under high voltage bias. Automotive electronics has simultaneously transitioned to copper wire-bond from gold wire-bond for first-level interconnections. Copper has a smaller process window and a higher propensity for corrosion in comparison with gold wire bonds. There is scarce information on the reliability of copper wire bonds in presence of high voltage bias under operation at high temperature. In this paper, a multiphysics model for micro galvanic corrosion in the presence of chlorine is introduced. The diffusion cell is used to measure the diffusivity of chlorine in different pH values and different temperatures. Diffusivity measurements are incorporated into the 3D ionic transport model to study the effect of different environmental factors on the transport rate of chlorine. The tafel parameters for copper, aluminum and intermetallics have been extracted through measurements of the polarization curves. The multiple physics of ionic transport in presence of concentration gradient, potential gradient is coupled with the galvanic corrosion.