2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
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ASMC 2007 is produced by Semi in In sponsorship with IEEE

2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2007.375051 ◽

2007 ◽

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Impact of Mobile Charge on Matching Sensitivity in SOI Analog Circuits

2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2007.375101 ◽

2007 ◽

Cited By ~ 3

Author(s):

M. Connell ◽

M. Grady ◽

P. Oldiges ◽

D. Onsongo ◽

M. Passaro ◽

...

Keyword(s):

Analog Circuits ◽

Mobile Charge

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Effective Process Equipment Defect Control Methodology

2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2007.375078 ◽

2007 ◽

Author(s):

Ali Bousetta ◽

Andrew J. Cross

Keyword(s):

Process Equipment ◽

Defect Control ◽

Control Methodology

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Implementation of Polycrystalline X-Ray Diffraction for Semiconductor Metrology

2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2007.375106 ◽

2007 ◽

Author(s):

P.W. DeHaven ◽

M. Jeanneret ◽

B. Gittleman ◽

K. Kozaczek

Keyword(s):

X Ray Diffraction ◽

X Ray

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Detection of a New Surface Killer Defect on Starting Si Material using Nomarski Principle of Differential Interference Contrast

2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2007.375102 ◽

2007 ◽

Author(s):

Chris Dennis ◽

Rhonda Stanley ◽

Steve Cui

Keyword(s):

Differential Interference Contrast

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Zero defect manufacturing as a challenge for advanced failure analysis

2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2007.375060 ◽

2007 ◽

Cited By ~ 1

Author(s):

Uwe Gabler ◽

Ingo Osterreicher ◽

Peter Bosk ◽

Christian Nowak

Keyword(s):

Failure Analysis

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Backside Detection of Photoresist Development Endpoint Using Surface Plasmon Resonance

2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2007.375117 ◽

2007 ◽

Author(s):

Tomi Ryynanen ◽

Jukka Lekkala

Keyword(s):

Surface Plasmon Resonance ◽

Surface Plasmon ◽

Plasmon Resonance

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Integrated Targeting, Near Real-Time Scheduling, and Dispatching with Automated Execution in Semiconductor Manufacturing

2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2007.4595689 ◽

2007 ◽

Cited By ~ 3

Author(s):

Nirmal Govind ◽

Eric Bullock ◽

Linling He ◽

Bala Iyer ◽

Murali Krishna ◽

...

Keyword(s):

Real Time ◽

Semiconductor Manufacturing ◽

Real Time Scheduling ◽

Time Scheduling

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Thickness and Topography of Dielectric Dual-Sidewall Spacers on Metal Gate of DRAM Extracted by Spectroscopic Ellipsometry

2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2007.375115 ◽

2007 ◽

Author(s):

Jun-Wei Gong ◽

Yeh-Chang Fang ◽

Ta-Yung Wang ◽

Jia-Rui Hu ◽

Chung-I Chang ◽

...

Keyword(s):

Spectroscopic Ellipsometry ◽

Metal Gate

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2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

ASMC 2007 is produced by Semi in In sponsorship with IEEE

Impact of Mobile Charge on Matching Sensitivity in SOI Analog Circuits

Effective Process Equipment Defect Control Methodology

Implementation of Polycrystalline X-Ray Diffraction for Semiconductor Metrology

Detection of a New Surface Killer Defect on Starting Si Material using Nomarski Principle of Differential Interference Contrast

Zero defect manufacturing as a challenge for advanced failure analysis

Sponsors

Backside Detection of Photoresist Development Endpoint Using Surface Plasmon Resonance

Integrated Targeting, Near Real-Time Scheduling, and Dispatching with Automated Execution in Semiconductor Manufacturing

Thickness and Topography of Dielectric Dual-Sidewall Spacers on Metal Gate of DRAM Extracted by Spectroscopic Ellipsometry

Export Citation Format

2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

ASMC 2007 is produced by Semi in In sponsorship with IEEE

Impact of Mobile Charge on Matching Sensitivity in SOI Analog Circuits

Effective Process Equipment Defect Control Methodology

Implementation of Polycrystalline X-Ray Diffraction for Semiconductor Metrology

Detection of a New Surface Killer Defect on Starting Si Material using Nomarski Principle of Differential Interference Contrast

Zero defect manufacturing as a challenge for advanced failure analysis

Sponsors

Backside Detection of Photoresist Development Endpoint Using Surface Plasmon Resonance

Integrated Targeting, Near Real-Time Scheduling, and Dispatching with Automated Execution in Semiconductor Manufacturing

Thickness and Topography of Dielectric Dual-Sidewall Spacers on Metal Gate of DRAM Extracted by Spectroscopic Ellipsometry

2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Latest Publications