2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
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9781467314435, 9781467314442, 9781467314459
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Chip-package-PCB co-design for optimization of wireless receiver performance

2012 ◽  
Author(s):  
Ruey-Bo Sun ◽  
Po-Yang Chang ◽  
Ting-Kuang Wang ◽  
Chih-Ming Hung
Keyword(s):  
Wireless Receiver ◽  
Receiver Performance

Signal integrity improvement in lossy transmission line using segmental transmission line

2012 ◽  
Author(s):  
Hiroki Shimada ◽  
Shohei Akita ◽  
Yusuke Kuribara ◽  
Ikuo Yoshihara ◽  
Moritoshi Yasunaga
Keyword(s):  
Transmission Line ◽  
Signal Integrity ◽  
Lossy Transmission ◽  
Lossy Transmission Line

Analysis and characterization of PDN impedance and SSO noise of 4k-IO 3D SiP

2012 ◽  
Author(s):  
Hiroki Takatani ◽  
Yosuke Tanaka ◽  
Haruya Fujita ◽  
Yoshiaki Oizono ◽  
Yoshitaka Nabeshima ◽  
...  

A linear 4-element model of VRM —Characteristics, practical uses and limitations

2012 ◽  
Author(s):  
Edward Hsin-Kuan Hsiung ◽  
Yuan-Liang Li ◽  
Ruey-Beei Wu ◽  
Thonas Su ◽  
Yung-Shou Cheng ◽  
...  
Keyword(s):  
Element Model

The effect of NBTI on 3D integrated circuits

2012 ◽  
Author(s):  
Cheng-Hong Lin ◽  
Yi-Chang Lu ◽  
Chin-Khai Tang ◽  
Kuen-Yu Tsai
Keyword(s):  
Integrated Circuits ◽  
3D Integrated Circuits

On-die PDN design and analysis for minimizing power supply noise

2012 ◽  
Author(s):  
Hiroki Otsuka ◽  
Genki Kubo ◽  
Ryota Kobayashi ◽  
Tatsuya Mido ◽  
Yoshinori Kobayashi ◽  
...  
Keyword(s):  
Power Supply ◽  
Power Supply Noise ◽  
Supply Noise
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