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Published By Springer New York

9781461404620, 9781461404637
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scholarly journals Erratum to: Theory on Mechanics of Solder Materials

2018 ◽  
pp. E1-E1
Author(s):  
J. H. L. Pang

Thermo-Mechanical Reliability Test and Analysis

2011 ◽  
pp. 89-122
Author(s):  
John Hock Lye Pang
Keyword(s):  
Reliability Test ◽  
Mechanical Reliability

Theory on Mechanics of Solder Materials

2011 ◽  
pp. 7-22
Author(s):  
John Hock Lye Pang

Fatigue Life Prediction Models

2011 ◽  
pp. 49-63
Author(s):  
John Hock Lye Pang
Keyword(s):  
Fatigue Life ◽  
Life Prediction ◽  
Prediction Models ◽  
Fatigue Life Prediction

Mechanical Properties and Constitutive Models

2011 ◽  
pp. 23-48
Author(s):  
John Hock Lye Pang
Keyword(s):  
Mechanical Properties ◽  
Constitutive Models

Dynamic Mechanical Reliability Test and Analysis

2011 ◽  
pp. 123-153
Author(s):  
John Hock Lye Pang
Keyword(s):  
Reliability Test ◽  
Mechanical Reliability ◽  
Dynamic Mechanical

Finite Element Analysis and Design-for-Reliability

2011 ◽  
pp. 65-88
Author(s):  
John Hock Lye Pang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Element Analysis ◽  
Design For Reliability ◽  
Analysis And Design

Introduction

2011 ◽  
pp. 1-5
Author(s):  
John Hock Lye Pang

Thermal Cycling Aging Effects on Board-Level Drop Test Result

2011 ◽  
pp. 155-170
Author(s):  
John Hock Lye Pang
Keyword(s):  
Thermal Cycling ◽  
Drop Test ◽  
Aging Effects ◽  
Board Level ◽  
Test Result
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