4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)

Thematic network adhesives in electronics-smart card roadmap

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) ◽

10.1109/adhes.2000.860628 ◽

2002 ◽

Author(s):

R. Aschenbrenner ◽

R. Miessner

Keyword(s):

Smart Card

Adhesion between photosensitive epoxy and electroless copper

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) ◽

10.1109/adhes.2000.860612 ◽

2002 ◽

Cited By ~ 1

Author(s):

J. Ge ◽

R. Tuominen ◽

J.K. Kivilahti

Keyword(s):

Electroless Copper

Roadmap "Adhesives Technologies in Automotive and Harsh Environment Applications"

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) ◽

10.1109/adhes.2000.860627 ◽

2002 ◽

Author(s):

O. Rusanen ◽

H. Rohde ◽

V. Brielmann

Keyword(s):

Harsh Environment

Applicability of no-flow fluxing encapsulants and flip chip technology in volume production

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) ◽

10.1109/adhes.2000.860592 ◽

2002 ◽

Cited By ~ 5

Author(s):

P. Palm ◽

K. Puhakka ◽

J. Maattanen ◽

T. Heimonen ◽

A. Tuominen

Keyword(s):

Flip Chip ◽

Chip Technology ◽

Volume Production

Reliability study of sub 100 micron pitch, flex-to-ITO/glass interconnection, bonded with an anisotropic conductive film

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) ◽

10.1109/adhes.2000.860599 ◽

2002 ◽

Author(s):

C.T. Murray ◽

P.B. Hogerton ◽

T. Chheang ◽

R.L. Rudman ◽

H. Egeberg

Keyword(s):

Anisotropic Conductive Film ◽

Reliability Study ◽

Conductive Film ◽

Ito Glass

Conductive adhesive for plated Sn or Sn/Pb electrode

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) ◽

10.1109/adhes.2000.860603 ◽

2002 ◽

Cited By ~ 1

Author(s):

M. Komagata ◽

G. Toida ◽

T. Hocchi ◽

K. Suzuki

Keyword(s):

Conductive Adhesive

Development of a rework-technology for flip-chips, using no-flow underfills

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) ◽

10.1109/adhes.2000.860591 ◽

2002 ◽

Cited By ~ 1

Author(s):

K.J. Wolter ◽

P. Fruhauf

Keyword(s):

Flip Chips

The evaluation of anisotropically conductive film for use in portable electronic products

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) ◽

10.1109/adhes.2000.860598 ◽

2002 ◽

Author(s):

K. Curran ◽

M. Holloway ◽

A. Lennox

Keyword(s):

Electronic Products ◽

Conductive Film

Development of high-density interconnection techniques for contactless smart cards

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) ◽

10.1109/adhes.2000.860573 ◽

2002 ◽

Cited By ~ 2

Author(s):

A. Aintila ◽

J. Sarkka ◽

J.K. Kivilahti

Keyword(s):

High Density ◽

Smart Cards

The influence of adhesive composition on mechanical and electrical properties of joints between SMDs and PCBs

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) ◽

10.1109/adhes.2000.860609 ◽

2002 ◽

Cited By ~ 1

Author(s):

R. Kisiel

Keyword(s):

Electrical Properties ◽

Adhesive Composition ◽

Mechanical And Electrical Properties

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thematic network adhesives in electronics-smart card roadmap

Adhesion between photosensitive epoxy and electroless copper

Roadmap "Adhesives Technologies in Automotive and Harsh Environment Applications"

Applicability of no-flow fluxing encapsulants and flip chip technology in volume production

Reliability study of sub 100 micron pitch, flex-to-ITO/glass interconnection, bonded with an anisotropic conductive film

Conductive adhesive for plated Sn or Sn/Pb electrode

Development of a rework-technology for flip-chips, using no-flow underfills

The evaluation of anisotropically conductive film for use in portable electronic products

Development of high-density interconnection techniques for contactless smart cards

The influence of adhesive composition on mechanical and electrical properties of joints between SMDs and PCBs

Export Citation Format

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thematic network adhesives in electronics-smart card roadmap

Adhesion between photosensitive epoxy and electroless copper

Roadmap "Adhesives Technologies in Automotive and Harsh Environment Applications"

Applicability of no-flow fluxing encapsulants and flip chip technology in volume production

Reliability study of sub 100 micron pitch, flex-to-ITO/glass interconnection, bonded with an anisotropic conductive film

Conductive adhesive for plated Sn or Sn/Pb electrode

Development of a rework-technology for flip-chips, using no-flow underfills

The evaluation of anisotropically conductive film for use in portable electronic products

Development of high-density interconnection techniques for contactless smart cards

The influence of adhesive composition on mechanical and electrical properties of joints between SMDs and PCBs

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)
Latest Publications