3D and Circuit Integration of MEMS
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9783527823239
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Piezoelectric MEMS

2021 ◽  
pp. 243-256
Author(s):  
T Takeshi Kobayashi (AIST)
Keyword(s):  
Piezoelectric Mems

Soldering by Local Heating

2021 ◽  
pp. 361-375
Author(s):  
Yu‐Ting Cheng ◽  
Liwei Lin
Keyword(s):  
Local Heating

Overview

2021 ◽  
pp. 1-11
Author(s):  
Masayoshi Esashi

Anodic Bonding

2021 ◽  
pp. 257-278
Author(s):  
Masayoshi Esashi
Keyword(s):  
Anodic Bonding

Heterogeneously Integrated Aluminum Nitride MEMS Resonators and Filters

2021 ◽  
pp. 113-130
Author(s):  
Enes Calayir ◽  
Srinivas Merugu ◽  
Jaewung Lee ◽  
Navab Singh ◽  
Gianluca Piazza
Keyword(s):  
Aluminum Nitride ◽  
Mems Resonators

Reactive Bonding

2021 ◽  
pp. 309-329
Author(s):  
Klaus Vogel ◽  
Silvia Braun ◽  
Christian Hofmann ◽  
Mathias Weiser ◽  
Maik Wiemer ◽  
...  

Epitaxial Poly Si Surface Micromachining

2021 ◽  
pp. 61-67
Author(s):  
Masayoshi Esashi
Keyword(s):  
Surface Micromachining

Enhanced Bulk Micromachining Based on MIS Process

2021 ◽  
pp. 49-59
Author(s):  
Xinxin Li ◽  
Heng Yang

Metal Bonding

2021 ◽  
pp. 289-307
Author(s):  
Joerg Froemel
Keyword(s):  
Metal Bonding

Metal Surface Micromachining

2021 ◽  
pp. 99-112
Author(s):  
Minoru Sasaki
Keyword(s):  
Metal Surface ◽  
Surface Micromachining
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