The Microfabricated Alkali Vapor Cell with High Hermeticity for Chip-Scale Atomic Clock

Herein, a microfabricated millimeter-level vapor alkali cell with a high hermeticity is fabricated through a wet etching and single-chip anodic bonding process. The vapor cell, containing Rb and N2, was investigated in a coherent population trapping (CPT) setup for the application of a chip-scale atomic clock (CSAC). The contrast of CPT resonance is up to 1.1% within the only 1 mm length of light interacting with atom. The effects of some critical external parameters on the CPT resonance, such as laser intensity, cell temperature, and buffer gas pressure, are thoroughly studied and optimized. The improved microfabricated vapor cell also exhibited great potential for other chip-scale atomic devices.

Lithium aluminosilicate glass-ceramics for low-temperature anodic sealing of MEMS sensors

The results of a study of the anodic bonding parameters of transparent glass-ceramics based on lithium aluminosilicates which are promising as structural materials of MEMS and MOEMS sensors are presented. A comparison of the optical transmittance of these materials and classical for MEMS industry glasses has been carried out. The glass-ceramics electrical conductivity in a wide temperature range has been measured. The procedure of hermetic sealing of glass-ceramics by the anodic bonding at temperatures of 150 – 250 °C has been worked out. A prototype of glass-ceramic atomic cell has been fabricated.

A resonant high-pressure sensor based on dual cavities

High-pressure sensors enable expansive demands in ocean sciences, industrial controls, and oil explorations. Successful sensor realized in piezoresistive high-pressure sensors which suffer from the key issue of compromised accuracies due to serious temperature drifts. Herein, this paper presents a high accuracy resonant high-pressure sensor with the pressure range of 70 MPa. Different from conventional resonant high-pressure sensor, the developed sensor utilized a dual-resonator-cavity design to minimize temperature disturbances and improve the pressure sensitivities. Besides, four circle cavities were used to maintain a high vacuum level for resonators after anodic bonding process. In details, Dual resonators, which is parallelly placed in the tensile and compressive stresses areas of a rectangular pressure sensitive diaphragm, are separated vacuum-packaged in the parallel dual cavities. Thus, pressure under measurement bends the pressure sensitive diaphragm, producing an increased pressure sensitivity and a decreased temperature sensitivity by the differential outputs of the dual resonators. Parameterized mathematical models of the sensor were established and the parameters of the models were optimized to adjust the pressure sensitivities and the temperature sensitivities of the sensor. Simplified deep reactive ion etching was used to form the sensing structure of the sensor and only once anodic bonding was used to form vacuum packaging for the dual resonators. Experimental results confirmed that the Q values of the resonators were higher than 32 000. Besides, the temperature sensitivity of the sensor was reduced from 44 Hz °C−1 (494 ppm °C−1) to 1 Hz °C−1 (11 ppm °C−1) by the differential outputs of the dual resonators in the temperature range of −10 °C–60 °C under the pressure of 1000 kPa. In addition, the accuracy of the sensor was better than 0.02% FS within the pressure range of 110–6500 kPa and the temperature range of −10 °C–60 °C by using a polynomial algorithm.

Microfabrication of Alkali Vapor MEMS Cells for chip-scale atomic clock

The technology of MEMS atomic cells containing rubidium or caesium vapors in an atmosphere of neon buffer gas has been developed. Two-chamber silicon cells containing an optical cavity, shallow filtration channels and a technical container for a solid-state alkali source have been implemented in a single-step process of anisotropic wet chemical etching. To prevent significant undercutting of the filtration channels during etching of the through silicon cavities, the shapes of the compensating elements at the convex corners of the silicon nitride mask have been calculated and the composition of the silicon etchant has been experimentally found. The sealing of the cells has been carried out by silicon-glass anodic bonding at a temperature of 250 °C. For this purpose the LK5 glass which has an increased ionic conductivity in comparison with the conventional glass Borofloat 33 was used. The best microfabricated cells allowed us to obtain estimates of the relative instability of the coherent population trapping resonance frequency at the level of 5 · 10-11 at 1 s.

Temperature Compensated Wide-Range Micro Pressure Sensor with Polyimide Anticorrosive Coating for Harsh Environment Applications

In this work, a MEMS piezoresistive micro pressure sensor (1.5 × 1.5 × 0.82 mm) is designed and fabricated with SOI-based micromachining technology and assembled using anodic bonding technology. In order to optimize the linearity and sensitivity over a wide effective pressure range (0–5 MPa) and temperature range (25–125 °C), the diaphragm thickness and the insulation of piezoresistors are precisely controlled by an optimized micromachining process. The consistency of the four piezoresistors is greatly improved by optimizing the structure of the ohmic contact pads. Furthermore, the probability of piezoresistive breakdown during anodic bonding is greatly reduced by conducting the top and bottom silicon of the SOI. At room temperature, the pressure sensor with 40 µm diaphragm demonstrates reliable linearity (0.48% F.S.) and sensitivity (33.04 mV/MPa) over a wide pressure range of 0–5.0 MPa. In addition, a polyimide protection layer is fabricated on the top surface of the sensor to prevent it from corrosion by a moist marine environment. To overcome the linearity drift due to temperature variation in practice, a digital temperature compensation system is developed for the pressure sensor, which shows a maximum error of 0.43% F.S. in a temperature range of 25–125 °C.

Short-Pulse Laser-Assisted Fabrication of a Si-SiO2 Microcooling Device

Thermal management is one of the main challenges in the most demanding detector technologies and for the future of microelectronics. Microfluidic cooling has been proposed as a fully integrated solution to the heat dissipation problem in modern high-power microelectronics. Traditional manufacturing of silicon-based microfluidic devices involves advanced, mask-based lithography techniques for surface patterning. The limited availability of such facilities prevents widespread development and use. We demonstrate the relevance of maskless laser writing to advantageously replace lithographic steps and provide a more prototype-friendly process flow. We use a 20 W infrared laser with a pulse duration of 50 ps to engrave and drill a 525 μm-thick silicon wafer. Anodic bonding to a SiO2 wafer is used to encapsulate the patterned surface. Mechanically clamped inlet/outlet connectors complete the fully operational microcooling device. The functionality of the device has been validated by thermofluidic measurements. Our approach constitutes a modular microfabrication solution that should facilitate prototyping studies of new concepts for co-designed electronics and microfluidics.

Development and post-dicing wet release of MEMS magnetometer: an approach

Purpose Si-based micro electro mechanical systems (MEMS) magnetometer does not require specialized magnetic materials avoiding magnetic hysteresis, ease in fabrication and low power consumption. It can be fabricated using the same processes used for gyroscope and accelerometer fabrication. The paper reports the dicing mechanism for the released MEMS xylophone magnetic sensor fabricated using wafer bonding technology and its characterization in ambient pressure and under vacuum conditions. The purpose of this paper is to dice the wafer bonded Si-magnetometer in a cost-effective way without the use of laser dicing and test it for Lorentz force transduction. Design/methodology/approach A xylophone bar MEMS magnetometer using Lorentz force transduction is developed. The fabricated MEMS-based xylophone bars in literature are approximately 500 µm. The present work shows the released structure (L = 592 µm) fabricated by anodic bonding technique using conducting Si as the structural layer and tested for Lorentz force transduction. The microstructures fabricated at the wafer level are released. Dicing these released structures using conventional diamond blade dicing may damage the structures and reduce the yield. To avoid the problem, positive photoresist S1813 was filled before dicing. The dicing of the wafer, filled with photoresist and later removal of photoresist post dicing, is proposed. Findings The devices realized are stiction free and straight. The dynamic measurements are done using laser Doppler vibrometer to verify the released structure and test its functionality for Lorentz force transduction. The magnetic field is applied using a permanent magnet and Helmholtz coil. Two sensors with quality factors 70 and 238 are tested with resonant frequency 112.38 kHz and 114.38 kHz, respectively. The sensor D2, with Q as 238, shows a mechanical sensitivity of 500 pm/Gauss and theoretical Brownian noise-limited resolution of 53 nT/vHz. Originality/value The methodology and the study will help develop Lorentz force–based MEMS magnetometers such that stiction-free structures are released using wet etch after the mechanical dicing.

Finite Element Modelling of Air-Coupled Circular Capacitive Micromachined Ultrasonic Transducer for Anodic Bonding Process using SOI Wafer

Capacitive Micromachined Ultrasonic Transducer (CMUT) provides an alternative to commercial piezoelectric-based ultrasonic transducers due to its wide bandwidth, improved efficiency, sensitivity, and design flexibility [1, 2]. In this paper, Finite Element Method-based design and simulations of circular capacitive micromachined ultrasonic transducer (CMUT) is presented. The FEM simulation of air-coupled CMUT was accomplished by using MEMCAD tools CoventorWare® and COMSOL™. The resonance frequency of 3.9 MHz was achieved for the designed circular CMUT device. A favourable agreement was found for the resonance frequency and pull-in voltage of the device using MEMSCAD tools and analytical calculations. For the proposed CMUT design, a circular cavity will be formed inside the glass substrate. Then, a free-standing membrane will be released using active layer of silicon-on-insulator (SOI) wafer. The bulk silicon of SOI wafer will be removed after bonding it on the glass substrate using anodic bonding technique as described in fabrication process flow for CMUT.