2006 IEEE Electrical Performane of Electronic Packaging
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100
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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Common Mode Return Loss Consideration in Wirebond Packaging for High Speed SerDes Links

2006 ◽  
Author(s):  
Nanju Na ◽  
Marcel Arseneault ◽  
Katsuyuki Yonehara ◽  
Haitian Hu ◽  
Deborah Zwitter ◽  
...  
Keyword(s):  
High Speed ◽  
Return Loss ◽  
Common Mode

Dielectric Constant and Loss Tangent Characterization of Thin High-K Dielectrics Using Corner-to-Corner Plane Probing

2006 ◽  
Author(s):  
A. Ege Engin ◽  
Abdemanaf Tambawala ◽  
Madhavan Swaminathan ◽  
Swapan Bhattacharya ◽  
Pranabes Pramanik ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Loss Tangent ◽  
Dielectric Constant And Loss ◽  
High K

scholarly journals Effect of EBG Structures for Reducing Noise in Multi-Layer PCBs for Digital Systems

2006 ◽  
Author(s):  
Daehyun Chung ◽  
Tae Kim ◽  
Chunghyun Ryu ◽  
Ege Engin ◽  
Madhavan Swaminathan ◽  
...  
Keyword(s):  
Digital Systems
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