Electronic Thin-Film Reliability
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Published By Cambridge University Press

9780511777691

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Thin-film applications to microelectronic technology

Electronic Thin-Film Reliability ◽

10.1017/cbo9780511777691.002 ◽

2014 ◽

pp. 1-13

Author(s):

King-Ning Tu

Keyword(s):

Thin Film ◽

Microelectronic Technology

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Electromigration-induced failure in Al and Cu interconnects

Electronic Thin-Film Reliability ◽

10.1017/cbo9780511777691.013 ◽

2014 ◽

pp. 270-288

Author(s):

King-Ning Tu

Keyword(s):

Cu Interconnects

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Surface energies

Electronic Thin-Film Reliability ◽

10.1017/cbo9780511777691.004 ◽

2014 ◽

pp. 30-59

Author(s):

King-Ning Tu

Keyword(s):

Surface Energies

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Reliability science and analysis

Electronic Thin-Film Reliability ◽

10.1017/cbo9780511777691.016 ◽

2014 ◽

pp. 336-362

Author(s):

King-Ning Tu

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Grain-boundary diffusion

Electronic Thin-Film Reliability ◽

10.1017/cbo9780511777691.010 ◽

2014 ◽

pp. 192-211

Author(s):

King-Ning Tu

Keyword(s):

Grain Boundary ◽

Boundary Diffusion ◽

Grain Boundary Diffusion

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Surface kinetic processes on thin films

Electronic Thin-Film Reliability ◽

10.1017/cbo9780511777691.008 ◽

2014 ◽

pp. 141-169

Author(s):

King-Ning Tu

Keyword(s):

Kinetic Processes

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Irreversible processes in interconnect and packaging technology

Electronic Thin-Film Reliability ◽

10.1017/cbo9780511777691.011 ◽

2014 ◽

pp. 212-236

Author(s):

King-Ning Tu

Keyword(s):

Irreversible Processes ◽

Packaging Technology

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Applications of the diffusion equation

Electronic Thin-Film Reliability ◽

10.1017/cbo9780511777691.006 ◽

2014 ◽

pp. 86-117

Author(s):

King-Ning Tu

Keyword(s):

Diffusion Equation

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Preface

Electronic Thin-Film Reliability ◽

10.1017/cbo9780511777691.001 ◽

2014 ◽

pp. xv-xvi

Author(s):

King-Ning Tu

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Interdiffusion and reaction in thin films

Electronic Thin-Film Reliability ◽

10.1017/cbo9780511777691.009 ◽

2014 ◽

pp. 170-191

Author(s):

King-Ning Tu

Keyword(s):

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