2010 12th Electronics Packaging Technology Conference
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9781424485604
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Microelectrothermofluidic packaging for single chip integrated viral RNA extraction and RT-PCR microdevices

2010 ◽  
Author(s):  
Tae Goo Kang ◽  
Hong Miao Ji ◽  
Siow Pin Melvin Tan ◽  
Guang Kai Ignatius Tay ◽  
Ming Yi Daniel Ang ◽  
...  
Keyword(s):  
Rna Extraction ◽  
Viral Rna ◽  
Single Chip ◽  
Rt Pcr

Development on integrated passive devices using wafer level package technologies

2010 ◽  
Author(s):  
Byeung-Gee Kim ◽  
Yun-Mook Park ◽  
Jun-Kyu Lee ◽  
In-Soo Kang
Keyword(s):  
Wafer Level ◽  
Passive Devices ◽  
Wafer Level Package

Die crack mechanism study and improvement on 54ld SOIC EP package

2010 ◽  
Author(s):  
Wang Zhijie ◽  
Tony Lim ◽  
Jiang YingWei ◽  
Zhang ChangLiang ◽  
Yin BaoGuan ◽  
...  
Keyword(s):  
Mechanism Study

Autocatalytic deposition of nananocrystalline ternary Ni-Co-P deposits: Preparation and characterization

2010 ◽  
Author(s):  
J.N. Balaraju ◽  
Chaitanya Parashar ◽  
K.S. Rajam

Coreless substrates status

2010 ◽  
Author(s):  
Bernd K Appelt ◽  
Bruce Su ◽  
Yi-Shao Lai ◽  
Alex SF Huang

scholarly journals Effect of addition Cobalt nanoparticles on Sn-Ag-Cu lead-free solder

2010 ◽  
Author(s):  
S.L. Tay ◽  
A.S.M.A. Haseeb ◽  
Johan Mohd Rafie
Keyword(s):  
Cobalt Nanoparticles ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder
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