3D Integration for VLSI Systems
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Published By Pan Stanford Publishing

9789814303811, 9789814303828
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

3D IC Design Automation Considering Dynamic Power and Thermal Integrity

2011 ◽  
pp. 335-350
Author(s):  
Hao Yu ◽  
Xiwei Huang
Keyword(s):  
Design Automation ◽  
Ic Design ◽  
3D Ic ◽  
Dynamic Power ◽  
Thermal Integrity

Thermal-Aware 3D IC Designs

2011 ◽  
pp. 313-334 ◽  
Author(s):  
Xiaoxia Wu ◽  
Yuan Xie ◽  
Vijaykirshnan Narayanan
Keyword(s):  
3D Ic

Advanced Direct Bond Technology Paul Enquist

2011 ◽  
pp. 175-203 ◽  
Author(s):  
Paul Enquist
Keyword(s):  
Direct Bond

3D Technology Platform

2011 ◽  
pp. 121-138 ◽  
Author(s):  
Mark Privett
Keyword(s):  
3D Technology ◽  
Technology Platform

Wafer Bonding Techniques

2011 ◽  
pp. 43-70
Author(s):  
Bioh Kim ◽  
Thorsten Matthias ◽  
Viorel Dragoi ◽  
Markus Wimplinger ◽  
Paul Lindner
Keyword(s):  
Wafer Bonding

A Systems Perspective on 3D Integration

2011 ◽  
pp. 27-42 ◽  
Author(s):  
Phil Emma ◽  
Eren Kursun
Keyword(s):  
3D Integration ◽  
Systems Perspective

Advanced Die-to-Wafer 3D Integration Platform

2011 ◽  
pp. 153-174
Author(s):  
Takafumi fukushima ◽  
Kang-Wook Lee ◽  
Tetsu Tanaka ◽  
Mitsumasa Koyanagi
Keyword(s):  
3D Integration ◽  
Integration Platform

Index

2011 ◽  
pp. 367-369

Outlook

2011 ◽  
pp. 351-366
Author(s):  
Ya Yang
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