Towards Blockchain Network Platform for IoT Data Integrity and Scalability

<p>Decentralised technology backed by blockchain has gained popularity in recent years, as it secures autonomous ecosystems without the need for a central authority. The blockchain concept originated in the financial domain using cryptocurrency but has been applied to a variety of industries over the last few years. In the era of Industry 4.0, most enterprises leverage automation by using Internet of Things (IoT) technology. Despite the numerous applications of blockchain across industries, significant latency in the consensus algorithm in blockchain hinders its adoption among businesses using IoT technology. A number of studies have addressed the obstacles of transaction processing performance and system scalability, mostly based on a public blockchain. However, the approaches still involve centralised components and thus fail to fully utilise decentralisation. Here, a private blockchain-based IoT data integration platform is proposed to achieve data integrity and system scalability. Along with a lightweight IoT gateway, instead of any other additional middleware, the process and the system configuration are streamlined. By using Hyperledger Fabric, the design is validated, and the proposed architecture outperforms other conventional models in IoT data processing. Thus, decentralisation in IoT environments is achieved.</p>

Towards Blockchain Network Platform for IoT Data Integrity and Scalability

<p>Decentralised technology backed by blockchain has gained popularity in recent years, as it secures autonomous ecosystems without the need for a central authority. The blockchain concept originated in the financial domain using cryptocurrency but has been applied to a variety of industries over the last few years. In the era of Industry 4.0, most enterprises leverage automation by using Internet of Things (IoT) technology. Despite the numerous applications of blockchain across industries, significant latency in the consensus algorithm in blockchain hinders its adoption among businesses using IoT technology. A number of studies have addressed the obstacles of transaction processing performance and system scalability, mostly based on a public blockchain. However, the approaches still involve centralised components and thus fail to fully utilise decentralisation. Here, a private blockchain-based IoT data integration platform is proposed to achieve data integrity and system scalability. Along with a lightweight IoT gateway, instead of any other additional middleware, the process and the system configuration are streamlined. By using Hyperledger Fabric, the design is validated, and the proposed architecture outperforms other conventional models in IoT data processing. Thus, decentralisation in IoT environments is achieved.</p>

Integration platform of information educational solutions as a component of distance learning technology in a higher educational institution (on the example of the North-Eastern State University)

В статье рассматривается построение дистанционного обучения в высшем учебном заведении с помощью информационных образовательных технологий и решений. Рассмотрены действующие в ФГБОУ ВО «Северо-Восточный государственный университет» технологии организации дистанционного обучения, их интеграционные возможности. Продемонстрированы возможности интеграционной платформы «Цифродром», созданной в университете

Development Management of Competence Centers

The article provides a classification of centers of competence, which e subdivided into corporate, university, regional, industry, as well as excellent scientific and educational centers. The features of the work and areas of activity of each of the centers presented according to the classification are considered. In addition, the analysis of possible models of the competence center: value chain, digital integration platform and ecosystem carried out. The advantages and disadvantages of each of the models considered, their graphic interpretation presented. Based on the results of consideration of each of the models of competence centers, a justification made for the choice of one or another model of the competence center, depending on the specifics of the organization. In the course of the research, the main digital competencies (soft skills and hard skills) also considered. In accordance with these competencies, an analysis was made of the compliance of these competencies with each of the three models of interaction between participants in the creation of products (services) (value chain, digital integration platform and ecosystem). Because of the analysis, the choice of each of the considered models realized, depending on their compliance with new digital competencies.

Study of an Integration Platform Based on an Adiabatic Active-Layer Waveguide Connection for InP Photonic Device Integration Mirroring That of Heterogeneous Integration on Silicon

In this work, a photonic device integration platform capable of integration of active-passive InP-based photonic devices without the use of material regrowth is introduced. The platform makes use of an adiabatic active-layer waveguide connection (ALWC) to move an optical beam between active and passive devices. The performance of this platform is analyzed using an example made up of four main sections: (1) a fiber coupling section for enabling vertical beam coupling from optical fiber into the photonic chip using a mode-matched surface grating with apodized duty cycles; (2) a transparent waveguide section for realizing passive photonic devices; (3) an adiabatic mode connection structure for moving the optical beam between passive and active device sections; and (4) an active device section for realizing active photonic devices. It is shown that the coupled surface grating, when added with a bottom gold reflector, can achieve a high chip-to-fiber coupling efficiency (CE) of 88.3% at 1550 nm. The adiabatic active-layer mode connection structure has an optical loss of lower than 1% (CE > 99%). The active device section can achieve an optical gain of 20 dB/mm with the use of only 3 quantum wells. The optimized structural parameters of the entire waveguide module are analyzed and discussed.