Characterization of Integrated Circuit Packaging Materials
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Published By Elsevier

9780750692670

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Inductively Coupled Plasma-Optical Emission Spectroscopy (ICP-OES)*

Characterization of Integrated Circuit Packaging Materials ◽

10.1016/b978-0-7506-9267-0.50032-6 ◽

1993 ◽

pp. 237

Keyword(s):

Inductively Coupled Plasma ◽

Emission Spectroscopy ◽

Optical Emission Spectroscopy ◽

Optical Emission ◽

Icp Oes ◽

Inductively Coupled ◽

Plasma Optical Emission Spectroscopy

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Preface to Series

Characterization of Integrated Circuit Packaging Materials ◽

10.1016/b978-0-7506-9267-0.50005-3 ◽

1993 ◽

pp. xiii

Author(s):

C.R. Brundle ◽

C.A. Evans

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Dedication

Characterization of Integrated Circuit Packaging Materials ◽

10.1016/b978-0-7506-9267-0.50047-8 ◽

1993 ◽

pp. iv

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X-Ray Photoelectron Spectroscopy (XPS)*

Characterization of Integrated Circuit Packaging Materials ◽

10.1016/b978-0-7506-9267-0.50044-2 ◽

1993 ◽

pp. 263

Keyword(s):

Photoelectron Spectroscopy ◽

X Ray

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Mechanical Testing in IC Packaging

Characterization of Integrated Circuit Packaging Materials ◽

10.1016/b978-0-7506-9267-0.50035-1 ◽

1993 ◽

pp. 243-246

Author(s):

LAWRENCE C. WAGNER

Keyword(s):

Mechanical Testing ◽

Ic Packaging

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Decapsulation Techniques

Characterization of Integrated Circuit Packaging Materials ◽

10.1016/b978-0-7506-9267-0.50023-5 ◽

1993 ◽

pp. 222-224

Author(s):

LAWRENCE C. WAGNER

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Moisture Sensitivity and Delamination

Characterization of Integrated Circuit Packaging Materials ◽

10.1016/b978-0-7506-9267-0.50011-9 ◽

1993 ◽

pp. 79-96 ◽

Cited By ~ 1

Author(s):

THOMAS M. MOORE ◽

ROBERT G. McKENNA ◽

SHAWN J. KELSALL

Keyword(s):

Moisture Sensitivity

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Finite Element Analysis (FEA)

Characterization of Integrated Circuit Packaging Materials ◽

10.1016/b978-0-7506-9267-0.50029-6 ◽

1993 ◽

pp. 232-234

Author(s):

DARVIN R. EDWARDS ◽

STEVE GROOTHUIS

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Element Analysis

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Ceramic Plate Test (CPT) for Evaluating the Solderability of IC Devices

Characterization of Integrated Circuit Packaging Materials ◽

10.1016/b978-0-7506-9267-0.50021-1 ◽

1993 ◽

pp. 215-217

Author(s):

TIMOTHY McGUIGGAN

Keyword(s):

Ceramic Plate ◽

Plate Test

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Thermal Management

Characterization of Integrated Circuit Packaging Materials ◽

10.1016/b978-0-7506-9267-0.50012-0 ◽

1993 ◽

pp. 97-119

Author(s):

MOSTAFA AGHAZEDEH

Keyword(s):

Thermal Management

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Characterization of Integrated Circuit Packaging MaterialsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Elsevier

Inductively Coupled Plasma-Optical Emission Spectroscopy (ICP-OES)*

Preface to Series

Dedication

X-Ray Photoelectron Spectroscopy (XPS)*

Mechanical Testing in IC Packaging

Decapsulation Techniques

Moisture Sensitivity and Delamination

Finite Element Analysis (FEA)

Ceramic Plate Test (CPT) for Evaluating the Solderability of IC Devices

Thermal Management

Characterization of Integrated Circuit Packaging Materials
Latest Publications