Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)
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Design and analysis of embedded inductor on low cost multilayer laminate MCM technology

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) ◽

10.1109/epep.2003.1250005 ◽

2003 ◽

Cited By ~ 9

Author(s):

R.C. Lee ◽

Gye-An Lee ◽

M. Megahed

Keyword(s):

Low Cost

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The Nittany Genome Project: a genetic algorithm approach to optimize a worst case bitstream for package simulation

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) ◽

10.1109/epep.2003.1250055 ◽

2003 ◽

Cited By ~ 3

Author(s):

S.M. Ulrich ◽

A.M. Wirick ◽

D. de Araujo ◽

N. Pham ◽

M. Cases

Keyword(s):

Genetic Algorithm ◽

Genome Project ◽

Worst Case ◽

Genetic Algorithm Approach

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Maintaining microprocessor compatibility across process generations

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) ◽

10.1109/epep.2003.1250020 ◽

2003 ◽

Author(s):

A. Sarangi ◽

S.R. Babcock ◽

J.R. Jones ◽

G.F. Taylor

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Mitigating multi-layer PCB power bus radiation through novel mesh fencing techniques

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) ◽

10.1109/epep.2003.1250033 ◽

2003 ◽

Author(s):

Xin Wu ◽

M.H. Kermani ◽

O.M. Ramahi

Keyword(s):

Power Bus

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Physically-based distributed models for multi-layer ceramic capacitors

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) ◽

10.1109/epep.2003.1250028 ◽

2003 ◽

Cited By ~ 5

Author(s):

C.R. Sullivan ◽

Yuqin Sun

Keyword(s):

Distributed Models ◽

Ceramic Capacitors ◽

Physically Based

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Dispersion and resonance of on-chip interconnect lines with underlayer orthogonal metal grids

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) ◽

10.1109/epep.2003.1250011 ◽

2003 ◽

Author(s):

Pingshan Wang ◽

E.C. Kan

Keyword(s):

On Chip ◽

Interconnect Lines

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Chip-package co-design for high-speed transmitter in serial links application

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) ◽

10.1109/epep.2003.1250035 ◽

2003 ◽

Cited By ~ 1

Author(s):

M. Shen ◽

Jian Liu ◽

Li-Rong Zheng ◽

H. Tenhunen

Keyword(s):

High Speed ◽

Serial Links

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Open load backward matching (OLBM) technique for low ISI differential H-tree clock and data transmission

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) ◽

10.1109/epep.2003.1250047 ◽

2003 ◽

Cited By ~ 1

Author(s):

Daehyun Chung ◽

Seungyong Baek ◽

Joungho Kim

Keyword(s):

Data Transmission

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Modeling of non-ideal planes in stripline structures

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) ◽

10.1109/epep.2003.1250042 ◽

2003 ◽

Cited By ~ 5

Author(s):

A.E. Engin ◽

W. John ◽

G. Sommer ◽

W. Mathis

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Significant reduction of power/ground inductive impedance and simultaneous switching noise by using embedded film capacitor

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) ◽

10.1109/epep.2003.1250015 ◽

2003 ◽

Cited By ~ 1

Author(s):

Hyungsoo Kim ◽

Youchul Jeong ◽

Jongbae Park ◽

SeokKyu-Lee ◽

JongKuk-Hong ◽

...

Keyword(s):

Switching Noise ◽

Film Capacitor ◽

Simultaneous Switching Noise ◽

Simultaneous Switching

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Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Design and analysis of embedded inductor on low cost multilayer laminate MCM technology

The Nittany Genome Project: a genetic algorithm approach to optimize a worst case bitstream for package simulation

Maintaining microprocessor compatibility across process generations

Mitigating multi-layer PCB power bus radiation through novel mesh fencing techniques

Physically-based distributed models for multi-layer ceramic capacitors

Dispersion and resonance of on-chip interconnect lines with underlayer orthogonal metal grids

Chip-package co-design for high-speed transmitter in serial links application

Open load backward matching (OLBM) technique for low ISI differential H-tree clock and data transmission

Modeling of non-ideal planes in stripline structures

Significant reduction of power/ground inductive impedance and simultaneous switching noise by using embedded film capacitor

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)
Latest Publications