2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS)
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781479923113, 9781479923137

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Modified pseudo eye metric for mismatched transmission lines

2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) ◽

10.1109/edaps.2013.6724436 ◽

2013 ◽

Author(s):

Chia-Lin Cheng ◽

Shih-Ya Huang ◽

Yung-Shou Cheng ◽

Ruey-Beei Wu

Keyword(s):

Transmission Lines

Download Full-text

Distortion-free stacked CMOS image sensor with 8.6-μm pitch micro-bump interconnections

2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) ◽

10.1109/edaps.2013.6724442 ◽

2013 ◽

Author(s):

Shugo Ishizuka ◽

Yoshiaki Takemoto ◽

Kenji Kobayashi ◽

Mitsuhiro Tsukimura ◽

Naohiro Takazawa ◽

...

Keyword(s):

Cmos Image Sensor ◽

Image Sensor

Download Full-text

Efficient modeling and analysis of multilayered power distribution network by using conformal mesh and block-type leapfrog scheme

2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) ◽

10.1109/edaps.2013.6724429 ◽

2013 ◽

Cited By ~ 3

Author(s):

Tadatoshi Sekine ◽

Hideki Asai

Keyword(s):

Power Distribution ◽

Distribution Network ◽

Block Type ◽

Power Distribution Network ◽

Modeling And Analysis ◽

Leapfrog Scheme ◽

Efficient Modeling

Download Full-text

Modal S-parameters and the circuit representation of symmetric circuits

2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) ◽

10.1109/edaps.2013.6724404 ◽

2013 ◽

Cited By ~ 1

Author(s):

Yoshikazu Fujishiro ◽

Takahiko Yamamoto ◽

Kohji Koshiji

Keyword(s):

Circuit Representation ◽

S Parameters

Download Full-text

Design of crosstalk compensation passive equalizers for high-speed differential signaling on 2.5D-IC interposer

2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) ◽

10.1109/edaps.2013.6724437 ◽

2013 ◽

Author(s):

Sumin Choi ◽

Heegon Kim ◽

Sukjin Kim ◽

Daniel H. Jung ◽

Joungho Kim ◽

...

Keyword(s):

High Speed ◽

Differential Signaling

Download Full-text

Comparing fast convolution and model order reduction methods for S-parameter simulation

2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) ◽

10.1109/edaps.2013.6724407 ◽

2013 ◽

Cited By ~ 4

Author(s):

Jose E. Schutt-Aine ◽

Patrick Goh

Keyword(s):

Model Order Reduction ◽

Order Reduction ◽

Model Order ◽

Fast Convolution ◽

S Parameter ◽

Reduction Methods

Download Full-text

Hardware accelerator for 3D method of moments based parasitic extraction

2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) ◽

10.1109/edaps.2013.6724399 ◽

2013 ◽

Author(s):

Anant Devi ◽

Maulik Gandhi ◽

Kuruvilla Varghese ◽

Dipanjan Gope

Keyword(s):

Method Of Moments ◽

Hardware Accelerator ◽

Parasitic Extraction

Download Full-text

Nonlinear locally implicit LIM for the simulation of PDN modeled by triangular meshes

2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) ◽

10.1109/edaps.2013.6724395 ◽

2013 ◽

Cited By ~ 1

Author(s):

Shingo Okada ◽

Tadatoshi Sekine ◽

Hideki Asai

Keyword(s):

Triangular Meshes

Download Full-text

Development of decoupling capacitor embedded interposers using narrow gap chip parts mounting technology with wideband ultralow PDN impedance

2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) ◽

10.1109/edaps.2013.6724444 ◽

2013 ◽

Cited By ~ 4

Author(s):

Katsuya Kikuchi ◽

Masahiro Aoyagi ◽

Masaaki Ujiie ◽

Shinya Takayama

Keyword(s):

Narrow Gap ◽

Decoupling Capacitor

Download Full-text

A novel EBG power plane structure for suppressing SSN in high speed systems

2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) ◽

10.1109/edaps.2013.6724433 ◽

2013 ◽

Author(s):

Jai Narayan Tripathi ◽

Jayanta Mukherjee ◽

Prakash R. Apte ◽

Raj Kumar Nagpal ◽

Nitin Kumar Chhabra ◽

...

Keyword(s):

High Speed

Download Full-text

2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Modified pseudo eye metric for mismatched transmission lines

Distortion-free stacked CMOS image sensor with 8.6-μm pitch micro-bump interconnections

Efficient modeling and analysis of multilayered power distribution network by using conformal mesh and block-type leapfrog scheme

Modal S-parameters and the circuit representation of symmetric circuits

Design of crosstalk compensation passive equalizers for high-speed differential signaling on 2.5D-IC interposer

Comparing fast convolution and model order reduction methods for S-parameter simulation

Hardware accelerator for 3D method of moments based parasitic extraction

Nonlinear locally implicit LIM for the simulation of PDN modeled by triangular meshes

Development of decoupling capacitor embedded interposers using narrow gap chip parts mounting technology with wideband ultralow PDN impedance

A novel EBG power plane structure for suppressing SSN in high speed systems

2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS)
Latest Publications