2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

Demonstration of a cost effective Cu electroless TSV metallization scheme

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) ◽

10.1109/iitc-mam.2015.7325618 ◽

2015 ◽

Cited By ~ 3

Author(s):

Kevin Vandersmissen ◽

F. Inoue ◽

D. Velenis ◽

Y. Li ◽

D. Dictus ◽

...

Keyword(s):

Cost Effective

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Electrical properties of 30 nm width bi-layer interconnects of multi layer graphene and Ni

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) ◽

10.1109/iitc-mam.2015.7325591 ◽

2015 ◽

Cited By ~ 1

Author(s):

Taishi Ishikura ◽

Atsunobu Isobayashi ◽

Daisuke Nishide ◽

Ban Ito ◽

Tatsuro Saito ◽

...

Keyword(s):

Electrical Properties ◽

Layer Graphene

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3D IC power benefit study under practical design considerations

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) ◽

10.1109/iitc-mam.2015.7325594 ◽

2015 ◽

Cited By ~ 2

Author(s):

Taigon Song ◽

Moongon Jung ◽

Yang Wan ◽

Yarui Peng ◽

Sung Kyu Lim

Keyword(s):

3D Ic ◽

Design Considerations ◽

Practical Design

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Direct copper electrodeposition on novel CoMo diffusion barrier

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) ◽

10.1109/iitc-mam.2015.7325637 ◽

2015 ◽

Cited By ~ 1

Author(s):

Xu Wang ◽

Li-Ao Cao ◽

Xin-Ping Qu

Keyword(s):

Diffusion Barrier ◽

Copper Electrodeposition

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Post-etch template removal strategy for reduction of plasma induced damage in spin-on OSG low-k dielectrics

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) ◽

10.1109/iitc-mam.2015.7325642 ◽

2015 ◽

Author(s):

M. Krishtab ◽

K. Vanstreels ◽

S. De Gendt ◽

M. Baklanov

Keyword(s):

Template Removal ◽

Low K

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Past general co chairs

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) ◽

10.1109/iitc-mam.2015.7325584 ◽

2015 ◽

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Organizing committee 2015

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) ◽

10.1109/iitc-mam.2015.7325583 ◽

2015 ◽

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A 300mm Si photonics platform for optical interconnection

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) ◽

10.1109/iitc-mam.2015.7325665 ◽

2015 ◽

Cited By ~ 3

Author(s):

Tohru Mogami ◽

Tsuyoshi Horikawa ◽

Keizo Kinoshita ◽

Hironori Sasaki ◽

Ken Morito ◽

...

Keyword(s):

Optical Interconnection ◽

Si Photonics

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Demonstration of new planar capacitor (PCAP) vehicles to evaluate dielectrics and metal barrier thin films

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) ◽

10.1109/iitc-mam.2015.7325646 ◽

2015 ◽

Author(s):

Kevin L. Lin ◽

Jeffrey Bielefeld ◽

Jasmeet S. Chawla ◽

Colin T. Carver ◽

Ramanan Chebiam ◽

...

Keyword(s):

Thin Films ◽

Planar Capacitor ◽

Metal Barrier

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Fabrication and characterization of piezoelectric microgenerators for flexible energy harvesting using P(VDF-TrFE) screen-formulated inks

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) ◽

10.1109/iitc-mam.2015.7325614 ◽

2015 ◽

Author(s):

E. Gusarova ◽

B. Viala ◽

A. Plihon ◽

B. Gusarov ◽

L. Gimeno ◽

...

Keyword(s):

Energy Harvesting ◽

Fabrication And Characterization

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2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Demonstration of a cost effective Cu electroless TSV metallization scheme

Electrical properties of 30 nm width bi-layer interconnects of multi layer graphene and Ni

3D IC power benefit study under practical design considerations

Direct copper electrodeposition on novel CoMo diffusion barrier

Post-etch template removal strategy for reduction of plasma induced damage in spin-on OSG low-k dielectrics

Past general co chairs

Organizing committee 2015

A 300mm Si photonics platform for optical interconnection

Demonstration of new planar capacitor (PCAP) vehicles to evaluate dielectrics and metal barrier thin films

Fabrication and characterization of piezoelectric microgenerators for flexible energy harvesting using P(VDF-TrFE) screen-formulated inks

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2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Demonstration of a cost effective Cu electroless TSV metallization scheme

Electrical properties of 30 nm width bi-layer interconnects of multi layer graphene and Ni

3D IC power benefit study under practical design considerations

Direct copper electrodeposition on novel CoMo diffusion barrier

Post-etch template removal strategy for reduction of plasma induced damage in spin-on OSG low-k dielectrics

Past general co chairs

Organizing committee 2015

A 300mm Si photonics platform for optical interconnection

Demonstration of new planar capacitor (PCAP) vehicles to evaluate dielectrics and metal barrier thin films

Fabrication and characterization of piezoelectric microgenerators for flexible energy harvesting using P(VDF-TrFE) screen-formulated inks

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)
Latest Publications