2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
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9781538615317

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Numerical modeling and optimization of a V-groove warm water cold-plate

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2017.7896948 ◽

2017 ◽

Cited By ~ 3

Author(s):

Yaser Hadad ◽

Bharath Ramakrishnan ◽

Sami Alkharabsheh ◽

Paul R. Chiarot ◽

Bahgat Sammakia

Keyword(s):

Numerical Modeling ◽

Warm Water ◽

Cold Plate ◽

Modeling And Optimization

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Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2017.7896911 ◽

2017 ◽

Cited By ~ 4

Author(s):

Unique Rahangdale ◽

Rahul Srinivas ◽

S. Krishnamurthy ◽

Pavan Rajmane ◽

Abel Misrak ◽

...

Keyword(s):

Solder Joint ◽

Thermal Cycling ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Power Cycling

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Development of a passively cooled outdoor telecom power enclosure

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2017.7896901 ◽

2017 ◽

Author(s):

Martin Cermak ◽

Mehran Ahmadi ◽

Majid Bahrami ◽

Kevin Lau

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2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2017.7896898 ◽

2017 ◽

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Oscillating flow in a heat sink with parallel micro channels

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2017.7896919 ◽

2017 ◽

Author(s):

Yiwu Kuang ◽

Wen Wang ◽

Rui Zhuan

Keyword(s):

Heat Sink ◽

Oscillating Flow ◽

Micro Channels

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Thermal performance of TIMs during compressive and tensile stress states

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2017.7896939 ◽

2017 ◽

Cited By ~ 1

Author(s):

Cameron Nelson ◽

Jesse Galloway ◽

Christopher Henry ◽

William Kelley

Keyword(s):

Tensile Stress ◽

Thermal Performance ◽

Stress States

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Using power trend predicator to improve datacenter thermal management efficiency

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2017.7896923 ◽

2017 ◽

Author(s):

Chuan Song ◽

Yanbing Sun ◽

Nishi Ahuja ◽

Xiaogang Sun ◽

Litrin Jiang ◽

...

Keyword(s):

Thermal Management ◽

Management Efficiency

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Rapid test method for thermal characteristics of semiconductor devices

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2017.7896932 ◽

2017 ◽

Author(s):

Shiwei Feng ◽

Dong Shi ◽

Xiang Zheng ◽

Jingwei Li ◽

Xin He ◽

...

Keyword(s):

Semiconductor Devices ◽

Thermal Characteristics ◽

Rapid Test ◽

Test Method

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Hyperspectral thermoreflectance imaging for power devices

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2017.7896931 ◽

2017 ◽

Cited By ~ 2

Author(s):

Dustin Kendig ◽

Kazuaki Yazawa ◽

Ali Shakouri

Keyword(s):

Power Devices

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Structure-aware Thermal Model reduction

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2017.7896907 ◽

2017 ◽

Author(s):

Tomasz Raszkowski ◽

Agnieszka Samson ◽

Mariusz Zubert ◽

Marcin Janicki ◽

Andrzej Napieralski

Keyword(s):

Model Reduction ◽

Thermal Model

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2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Numerical modeling and optimization of a V-groove warm water cold-plate

Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling

Development of a passively cooled outdoor telecom power enclosure

Table of contents

Oscillating flow in a heat sink with parallel micro channels

Thermal performance of TIMs during compressive and tensile stress states

Using power trend predicator to improve datacenter thermal management efficiency

Rapid test method for thermal characteristics of semiconductor devices

Hyperspectral thermoreflectance imaging for power devices

Structure-aware Thermal Model reduction

Export Citation Format

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Numerical modeling and optimization of a V-groove warm water cold-plate

Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling

Development of a passively cooled outdoor telecom power enclosure

Table of contents

Oscillating flow in a heat sink with parallel micro channels

Thermal performance of TIMs during compressive and tensile stress states

Using power trend predicator to improve datacenter thermal management efficiency

Rapid test method for thermal characteristics of semiconductor devices

Hyperspectral thermoreflectance imaging for power devices

Structure-aware Thermal Model reduction

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
Latest Publications