2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference
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9781424443413
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MEMS packaging IP and market status

2009 ◽  
Author(s):  
C.E. Bauer ◽  
R. A. Fillion ◽  
H. J. Neuhaus ◽  
Marc Papageorge
Keyword(s):  
Mems Packaging ◽  
Market Status

Analysis of promising copper wire bonding in assembly consideration

2009 ◽  
Author(s):  
Mu-Chun Wang ◽  
Zhen-Ying Hsieh ◽  
Kuo-Shu Huang ◽  
Chuan-Hsi Liu ◽  
Chii-Ruey Lin
Keyword(s):  
Copper Wire ◽  
Wire Bonding ◽  
Copper Wire Bonding

Thermal Performance of a Vapor Chamber Heat Pipe with Diamond-Copper Composition Wick Structures

2009 ◽  
Author(s):  
Ying-Tung Chen ◽  
Jr-Ming Miao ◽  
Dau-Yuan Ning ◽  
Te-Feng Chu ◽  
Wei-En Chen
Keyword(s):  
Heat Pipe ◽  
Thermal Performance ◽  
Vapor Chamber
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