2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Latest Publications

TOTAL DOCUMENTS

202

(FIVE YEARS 0)

H-INDEX

4

(FIVE YEARS 0)

Published By IEEE

9781424443413

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

The evaluation of assembly process for package on package components

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382226 ◽

2009 ◽

Author(s):

K. C. Li ◽

J.L. Ku ◽

Andrew Lee ◽

Jay CY Huang

Keyword(s):

Assembly Process

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Thermal Performance of a Vapor Chamber Heat Pipe with Diamond-Copper Composition Wick Structures

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382186 ◽

2009 ◽

Author(s):

Ying-Tung Chen ◽

Jr-Ming Miao ◽

Dau-Yuan Ning ◽

Te-Feng Chu ◽

Wei-En Chen

Keyword(s):

Heat Pipe ◽

Thermal Performance ◽

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Time dependent deformation behavior of interfacial intermetallic compounds in electronic solder joints

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382227 ◽

2009 ◽

Author(s):

Jenn-Ming Song ◽

Chien-Wei Su ◽

Yi-Shao Lai ◽

Ying-Ta Chiu

Keyword(s):

Intermetallic Compounds ◽

Deformation Behavior ◽

Solder Joints ◽

Time Dependent ◽

Interfacial Intermetallic Compounds

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Optimization of copper pillar bump design for fine pitch flip-chip packages

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382161 ◽

2009 ◽

Author(s):

Meng Tsung Lee ◽

Jung Pang Huang ◽

G.T Lin ◽

Y.H Lin ◽

Yih Jenn Jiang ◽

...

Keyword(s):

Flip Chip ◽

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Stress evaluations in micro bump structures of FCBGA

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382160 ◽

2009 ◽

Author(s):

Wan Yu Huang ◽

Eason Chen ◽

Don San Jiang ◽

Yu Po Wang ◽

James Chiang ◽

...

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Session 3: HDI, embedded & advanced technology

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382316 ◽

2009 ◽

Keyword(s):

Advanced Technology

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Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382153 ◽

2009 ◽

Author(s):

You-Chun Liang ◽

Chih Chen

Keyword(s):

Direct Measurement ◽

Flip Chip ◽

Solder Joints ◽

Hot Spot ◽

Infrared Microscopy ◽

Current Stressing ◽

Spot Temperature

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A novel resin composition for low Dk copper clad laminate

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382128 ◽

2009 ◽

Author(s):

June-Che Lu ◽

Yeong-Tong Hwang

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MEMS packaging IP and market status

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382176 ◽

2009 ◽

Author(s):

C.E. Bauer ◽

R. A. Fillion ◽

H. J. Neuhaus ◽

Marc Papageorge

Keyword(s):

Mems Packaging ◽

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Analysis of promising copper wire bonding in assembly consideration

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382168 ◽

2009 ◽

Author(s):

Mu-Chun Wang ◽

Zhen-Ying Hsieh ◽

Kuo-Shu Huang ◽

Chuan-Hsi Liu ◽

Chii-Ruey Lin

Keyword(s):

Copper Wire ◽

Wire Bonding ◽

Copper Wire Bonding

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