Time dependent deformation behavior of interfacial intermetallic compounds in electronic solder joints

2009 ◽  
Author(s):  
Jenn-Ming Song ◽  
Chien-Wei Su ◽  
Yi-Shao Lai ◽  
Ying-Ta Chiu
Keyword(s):  
Intermetallic Compounds ◽  
Deformation Behavior ◽  
Solder Joints ◽  
Time Dependent ◽  
Interfacial Intermetallic Compounds

Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints

2010 ◽  
Vol 25 (4) ◽  
pp. 629-632 ◽  
Author(s):  
Jenn-Ming Song ◽  
Chien-Wei Su ◽  
Yi-Shao Lai ◽  
Ying-Ta Chiu
Keyword(s):  
Crystal Structure ◽  
Plastic Deformation ◽  
Deformation Behavior ◽  
Solder Joints ◽  
Time Dependent ◽  
Creep Stress ◽  
Interfacial Intermetallic Compound ◽  
Creep Stress Exponent ◽  
Work Hardening Exponent ◽  
Good Agreement

Using nanoindentation, this study develops the criteria to evaluate the creep performance of the intermetallic compounds (IMCs) formed at the interface of microelectronic solder joints. Regardless of crystal structure and melting point, the creep stress exponent (X), one of the parameters determining creep resistance, is in good agreement with tendencies of the work-hardening exponent (n) and also the ratio of yield stress (Y) to Young's modulus (E), which reveals the ability against plastic deformation.

Time-Dependent Deformation Behavior of Amorphous Nitrogen-containing Carbon Films

1998 ◽  
Vol 37 (Part 1, No. 11) ◽  
pp. 6102-6106 ◽  
Author(s):  
Daisuke Tanaka ◽  
Shigeo Ohshio ◽  
Hidetoshi Saitoh
Keyword(s):  
Deformation Behavior ◽  
Carbon Films ◽  
Time Dependent
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