2008 International Interconnect Technology Conference
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TOTAL DOCUMENTS

72
(FIVE YEARS 0)

H-INDEX

11
(FIVE YEARS 0)

Published By IEEE

9781424419111
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Resistance to electromigration of purely intermetallic micro-bump interconnections for 3D-device stacking

2008 ◽  
Author(s):  
Riet Labie ◽  
Wouter Ruythooren ◽  
Kris Baert ◽  
Eric Beyne ◽  
Bart Swinnen
Keyword(s):  
Device Stacking

A Self-Aligned Air Gap Interconnect Process

2008 ◽  
Author(s):  
Hsien-Wei Chen ◽  
Shin-Puu Jeng ◽  
Hao-Yi Tsai ◽  
Yu-Wen Liu ◽  
CH Yu ◽  
...  
Keyword(s):  
Air Gap

An evaluation of electrografted copper seed layers for enhanced metallization of deep TSV structures

2008 ◽  
Author(s):  
S. Ledain ◽  
C. Bunel ◽  
P. Mangiagalli ◽  
A. Carles ◽  
N. Frederich ◽  
...  
Keyword(s):  
Seed Layers

Blech Effect and Lifetime Projection for Cu/Low-K Interconnects

2008 ◽  
Author(s):  
Cathryn Christiansen ◽  
Baozhen Li ◽  
Jason Gill
Keyword(s):  
Low K

Investigation of the impact of CoWp self-aligned barrier deposition on the porous siOC properties after a direct CMP process

2008 ◽  
Author(s):  
S. Gall ◽  
S. Olivier ◽  
M. Assou ◽  
M. Bernard ◽  
P.H. Haumesser ◽  
...  
Keyword(s):  
The Impact

Realization of via interconnects based on Carbon Nanotubes

2008 ◽  
Author(s):  
JC Coiffic ◽  
M. Fayolle ◽  
H. le Poche ◽  
S. Maitrejean ◽  
S. Olivier
Keyword(s):  
Carbon Nanotubes

scholarly journals Impact of Process Induced Stresses and Chip-Packaging Interaction on Reliability of Air-gap Interconnects

2008 ◽  
Author(s):  
Xuefeng Zhang ◽  
Suk-Kyu Ryu ◽  
Rui Huang ◽  
Paul S. Ho ◽  
Junjun Liu ◽  
...  
Keyword(s):  
Air Gap ◽  
Induced Stresses

Key factors to sustain the extension of a MHM-based integration scheme to medium and high porosity PECVD low-k materials

2008 ◽  
Author(s):  
Y. Travaly ◽  
J. van Aelst ◽  
V. Truffert ◽  
P. Verdonck ◽  
T. Dupont ◽  
...  
Keyword(s):  
Integration Scheme ◽  
High Porosity ◽  
Key Factors ◽  
Low K

Amorphous Ru / Polycrystalline Ru Highly Reliable Stacked Layer Barrier Technology

2008 ◽  
Author(s):  
Shinichi Ogawa ◽  
Nobuaki Tarumi ◽  
Mitsuhide Abe ◽  
Morio Shiohara ◽  
Hiroki Imamura ◽  
...  
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