2015 IEEE International Test Conference (ITC)
Latest Publications

TOTAL DOCUMENTS

59

(FIVE YEARS 0)

H-INDEX

9

(FIVE YEARS 0)

Published By IEEE

9781467365789

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Platform IO and system memory test using L3 cache based test (CBT) and parallel execution of CPGC Intel BIST engine

2015 IEEE International Test Conference (ITC) ◽

10.1109/test.2015.7342399 ◽

2015 ◽

Author(s):

Bruce Querbach ◽

Tan Peter Yanyang ◽

Lovelace Van ◽

David Blankenbeckler ◽

Rahul Khanna ◽

...

Keyword(s):

Memory Test ◽

Parallel Execution ◽

System Memory

A self-compensating built-in self-test solution for RF phased array mismatch

2015 IEEE International Test Conference (ITC) ◽

10.1109/test.2015.7342414 ◽

2015 ◽

Cited By ~ 9

Author(s):

Jae Woong Jeong ◽

Jennifer Kitchen ◽

Sule Ozev

Keyword(s):

Phased Array ◽

Test Solution ◽

Self Test ◽

Built In Self Test

Tolerance analysis of fixture fabrication, from drilling holes to pointing accuracy

2015 IEEE International Test Conference (ITC) ◽

10.1109/test.2015.7342401 ◽

2015 ◽

Cited By ~ 1

Author(s):

An-Jim Long ◽

David Tsai ◽

Kent Lien ◽

Steve Hsu

Keyword(s):

Tolerance Analysis ◽

Pointing Accuracy

Contactless pre-bond TSV fault diagnosis using duty-cycle detectors and ring oscillators

2015 IEEE International Test Conference (ITC) ◽

10.1109/test.2015.7342389 ◽

2015 ◽

Cited By ~ 12

Author(s):

Sergej Deutsch ◽

Krishnendu Chakrabarty

Keyword(s):

Fault Diagnosis ◽

Duty Cycle ◽

Ring Oscillators

Developing a modern platform for test engineering — Introducing the origen semiconductor developer's kit

2015 IEEE International Test Conference (ITC) ◽

10.1109/test.2015.7342393 ◽

2015 ◽

Cited By ~ 2

Author(s):

Stephen McGinty ◽

Daniel Hadad ◽

Chris Nappi ◽

Brian Caquelin

eRNA: Refining of reconstructed digital waveform

2015 IEEE International Test Conference (ITC) ◽

10.1109/test.2015.7342392 ◽

2015 ◽

Author(s):

Hideo Okawara

A DLL-based test solution for through silicon via (TSV) in 3D-stacked ICs

2015 IEEE International Test Conference (ITC) ◽

10.1109/test.2015.7342390 ◽

2015 ◽

Cited By ~ 4

Author(s):

Rashid Rashidzadeh ◽

Esrafil Jedari ◽

Tareq Muhammad Supon ◽

Vladimir Mashkovtsev

Keyword(s):

Test Solution ◽

Through Silicon Via

Hardware in loop testing of an insulin pump

2015 IEEE International Test Conference (ITC) ◽

10.1109/test.2015.7342416 ◽

2015 ◽

Cited By ~ 2

Author(s):

Sriram Karunagaran ◽

Karuna P. Sahoo ◽

Masahiro Fujita

Keyword(s):

Insulin Pump ◽

Hardware In Loop

An ATE system for testing 2.4-GHz RF digital communication devices with QAM signal interfaces

2015 IEEE International Test Conference (ITC) ◽

10.1109/test.2015.7342394 ◽

2015 ◽

Cited By ~ 1

Author(s):

Masahiro Ishida ◽

Kiyotaka Ichiyama

Keyword(s):

Digital Communication ◽

Communication Devices

A new method for measuring alias-free aperture jitter in an ADC output

2015 IEEE International Test Conference (ITC) ◽

10.1109/test.2015.7342384 ◽

2015 ◽

Cited By ~ 2

Author(s):

Takahiro J. Yamaguchi ◽

Katsuhiko Degawa ◽

Masayuki Kawabata ◽

Masahiro Ishida ◽

Kouichiro Uekusa ◽

...

Keyword(s):

New Method