2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Latest Publications

TOTAL DOCUMENTS

51

(FIVE YEARS 51)

H-INDEX

2

(FIVE YEARS 2)

Published By IEEE

9781728145853

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

LPDDR4 SIPI Co-Simulation and Measurement Correlation for IOT Computer Vision Application

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps47316.2019.193230 ◽

2019 ◽

Author(s):

Benjamin Silva ◽

Mohamed Eldessouki ◽

Yan Fen Shen

Keyword(s):

Computer Vision ◽

Vision Application

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Electrical Performance of Aerosol-Jet Printed Transmission Lines for High Speed Packaging Applications

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps47316.2019.193204 ◽

2019 ◽

Author(s):

Anubha A Gupta ◽

Michiel C.M. Soer ◽

Mohammad Taherzadeh-Sani ◽

Sylvain G. Cloutier ◽

Ricardo Izquierdo

Keyword(s):

Transmission Lines ◽

Electrical Performance

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An Approach For Tuning Signal Integrity Properties Of Edge Card Connectors With Conductive Fixture In High-Speed Link Channels

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps47316.2019.193238 ◽

2019 ◽

Author(s):

Yanyan Zhang ◽

Jose A. Hejase ◽

Mahesh Bohra ◽

Pavel R. Paladhi ◽

Lei Shan ◽

...

Keyword(s):

Signal Integrity

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Improved System Identification Modeling for High-speed Receiver

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps47316.2019.193212 ◽

2019 ◽

Author(s):

Bowen Li ◽

Brandon Jiao ◽

Min Huang ◽

Romi Mayder ◽

Paul Franzon

Keyword(s):

System Identification ◽

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Signal Integrity Considerations of PCB Wiring in Tightly Pitched Module Pin Fields of High Speed Channels

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps47316.2019.193216 ◽

2019 ◽

Author(s):

Joshua C. Myers ◽

Jose A. Hejase ◽

Junyan Tang ◽

Sungjun Chun ◽

Wiren D. Becker ◽

...

Keyword(s):

Signal Integrity

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Hybrid 2D-3D Fast Electromagnetic Analysis aided by Pattern Recognition for Signal Integrity Analysis

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps47316.2019.193196 ◽

2019 ◽

Author(s):

Manoranjan Sahoo ◽

Dipanjan Gope ◽

Nikita Ambasana ◽

D. Eesha ◽

Arun Chandrasekhar

Keyword(s):

Pattern Recognition ◽

Signal Integrity ◽

Electromagnetic Analysis ◽

Integrity Analysis

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Fast Yield Analysis for Power Delivery Networks

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps47316.2019.193219 ◽

2019 ◽

Author(s):

James Pingenot ◽

Daniel N. de Araujo

Keyword(s):

Power Delivery ◽

Power Delivery Networks ◽

Yield Analysis ◽

Delivery Networks

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EPEPS 2019 Keynote Address

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps47316.2019.9073249 ◽

2019 ◽

Keyword(s):

Keynote Address

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Evaluation of Neural Networks to Predict Target Impedance Violations of Power Delivery Networks

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps47316.2019.193225 ◽

2019 ◽

Author(s):

Christian M. Schierholz ◽

Katharina Scharff ◽

Christian Schuster

Keyword(s):

Neural Networks ◽

Power Delivery ◽

Power Delivery Networks ◽

Delivery Networks

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Microstrip Antenna EM Model Tuning using the Beatty Structure

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps47316.2019.193197 ◽

2019 ◽

Author(s):

Heidi Barnes ◽

Jose Moreira

Keyword(s):

Microstrip Antenna ◽

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