Monitoring Surface Quality on Molding and Sawing Processes for Solid Wood and Wood Panels

2013 ◽  
pp. 159-216
2005 ◽  
Vol 156 (3-4) ◽  
pp. 100-103
Author(s):  
Rudolf Popper ◽  
Peter Niemz ◽  
Gerhild Eberle

The water vapour diffusion resistance of timber materials were tested in a wet climate (relative humidity ranging from 100%to 65% at 20 °C) and in a dry climate (relative humidity ranging from 0% to 65% and from 0% to 35% at 20 °c) with variation by relative humidity and vapour pressure gradient. The diffusion resistance of multilayer solid wood panels lies under or within the range of the solid wood (spruce), tending even to a lower range. This can be attributed to the loosely inserted middle lamella of the used solid wood panels, which were not correctly glued by the manufacturer. The diffusion resistance of the solid wood panels increases with decreasing moisture content and decreasing panel thickness, as well as with increasing water vapour gradient from 818 to 1520 Pa. There were clear differences between the tested timber materials. The diffusion resistance of particle composites is strongly dependent on the specific gravity. Due to laminar particles OSBs(Oriented Strand Boards) have a larger diffusion resistance than chipboards. The water vapour diffusion resistance of OSBs lies within the range of plywood.


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