Solid wood panels (SWP). Requirements

2003 ◽  
Keyword(s):  
2005 ◽  
Vol 156 (3-4) ◽  
pp. 100-103
Author(s):  
Rudolf Popper ◽  
Peter Niemz ◽  
Gerhild Eberle

The water vapour diffusion resistance of timber materials were tested in a wet climate (relative humidity ranging from 100%to 65% at 20 °C) and in a dry climate (relative humidity ranging from 0% to 65% and from 0% to 35% at 20 °c) with variation by relative humidity and vapour pressure gradient. The diffusion resistance of multilayer solid wood panels lies under or within the range of the solid wood (spruce), tending even to a lower range. This can be attributed to the loosely inserted middle lamella of the used solid wood panels, which were not correctly glued by the manufacturer. The diffusion resistance of the solid wood panels increases with decreasing moisture content and decreasing panel thickness, as well as with increasing water vapour gradient from 818 to 1520 Pa. There were clear differences between the tested timber materials. The diffusion resistance of particle composites is strongly dependent on the specific gravity. Due to laminar particles OSBs(Oriented Strand Boards) have a larger diffusion resistance than chipboards. The water vapour diffusion resistance of OSBs lies within the range of plywood.


Holzforschung ◽  
2009 ◽  
Vol 63 (3) ◽  
Author(s):  
Thomas Gereke ◽  
Per Johan Gustafsson ◽  
Kent Persson ◽  
Peter Niemz

Abstract The moisture-induced warping of three-layered cross-laminated solid wood panels made of Norway spruce was studied. The panels were exposed to different climate conditions at 65% and 100% relative humidity at the two panel faces. The results showed increasing cup deformation with an increasing relative thickness of the outer layers. The annual growth ring orientation was found to have a significant influence on the magnitude of the cup deformation. Measurements and numerical simulations of the moisture distribution within the panel were made in order to provide data for numerical simulations of the warping. A distinctive moisture profile with a conspicuous influence of the adhesive bond lines was found. The coefficient of diffusion of the adhesive bond lines was determined from the measurements and simulations. The mechanical material model used for the warping simulations takes into account elastic strain, moisture-induced swelling, and mechano-sorptive strain. The simulations showed good agreement with the warping test results. The most important material parameters for the cup deformation, which were identified in a parametric study of a panel with vertically oriented annual rings, are the moduli of elasticity and the swelling coefficients in the longitudinal and radial direction. Furthermore, the mechano-sorptive coefficient in radial direction was found to have a significant influence on warp.


Sign in / Sign up

Export Citation Format

Share Document