In the market of lighting technologies, light-emitting diodes (LEDs) gradually substitute conventional light sources. Because of their high energy efficiency and long lifetime, they are increasingly used in consumer products, interior and exterior lighting applications in the home and mobility sector as well as in industrial applications. The material properties in the surrounding area of the light-emitting semiconductor chip are crucial to the performance of LED. Although the energy efficiency of LED is higher compared to conventional light sources, temperatures exceed about 150°C close to the semiconductor chip. Especially in combination with high amounts of blue ultraviolet (UV) radiation, the materials for encapsulation cannot meet the requirements and reduce the lifetime of an LED significantly. Contrary to conventional materials, high transparent liquid silicone rubber (LSR) can resist high temperatures as well as UV radiation and offer a great freedom in design. This enables the combination of the encapsulation (primary optics) and the secondary optics in one component. The objective of an ongoing joint research project with various partners from the industry is the development of an innovative injection moulding process for high precision optics in LED applications made of LSR, which is analysed at the Institute of Plastics Processing (IKV), Aachen, Germany. Therefore, the LED board is placed in the injection mould and overmoulded with LSR. The goal is a highly integrated process with major emphasis on the reduction of components, mounting steps and costs. Furthermore, the combination of primary and secondary optics promises an improved effectiveness because losses in light power due to the transition of the primary and secondary optics are reduced.
Micro‐ and Nanotexturization of Liquid Silicone Rubber Surfaces by Injection Moulding Using Hybrid Polymer Inlays
