P-2: Novel High Mobility Oxide TFT with Self-Aligned S/D Regions Formed by Wet-etch process

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of high mobility channels materials like Ge. The introduction of Ge as channel material has already shown significant interests in term of device performance enhancement [1,2]. However, the use of Ge in CMOS integration has raised new challenges in terms of clean or wet etch steps since significant Ge loss occurs when it oxidizes in aqueous media.


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