10.1: High Mobility Self-Aligned Top-Gate Oxide TFT for High-Resolution AM-OLED

2013 ◽  
Vol 44 (1) ◽  
pp. 85-88 ◽  
Author(s):  
Narihiro Morosawa ◽  
Masanori Nishiyama ◽  
Yoshihiro Ohshima ◽  
Ayumu Sato ◽  
Yasuhiro Terai ◽  
...  
2013 ◽  
Vol 21 (11) ◽  
pp. 467-473 ◽  
Author(s):  
Narihiro Morosawa ◽  
Masanori Nishiyama ◽  
Yoshihiro Ohshima ◽  
Ayumu Sato ◽  
Yasuhiro Terai ◽  
...  

2013 ◽  
Vol 44 (1) ◽  
pp. 18-21 ◽  
Author(s):  
Sang-Hee Ko Park ◽  
Jong Woo Kim ◽  
Minki Ryu ◽  
In Yong Eom ◽  
Jae-Eun Pi ◽  
...  

2021 ◽  
Vol 52 (S2) ◽  
pp. 48-50
Author(s):  
YuanJun Hsu ◽  
Zhenguo Lin ◽  
Yihong Lu ◽  
BaiXiang Han ◽  
Weiran Cao ◽  
...  

2009 ◽  
Vol 1155 ◽  
Author(s):  
Serge Oktyabrsky ◽  
Padmaja Nagaiah ◽  
Vadim Tokranov ◽  
Sergei Koveshnikov ◽  
Michael Yakimov ◽  
...  

AbstractGroup III-V semiconductor materials are being studied as potential replacements for conventional CMOS technology due to their better electron transport properties. However, the excess scattering of carriers in MOSFET channel due to high-k gate oxide interface significantly depreciates the benefits of III-V high-mobility channel materials. We present results on Hall electron mobility of buried QW structures influenced by remote scattering due to InGaAs/HfO2 interface. Mobility in In0.77Ga0.23As QWs degraded from 12000 to 1200 cm2/V-s and the mobility vs. temperature slope changed from T-1.2 to almost T+1.0 in 77-300 K range when the barrier thickness is reduced from 50 to 0 nm. This mobility change is attributed to remote Coulomb scattering due to charges and dipoles at semiconductor/oxide interface. Elimination of the InGaAs/HfO2 interface via introduction of SiOx interface layer formed by oxidation of thin a-Si passivation layer was found to improve the channel mobility. The mobility vs. sheet carrier density shows the maximum close to 2×1012 cm-2.


2012 ◽  
Vol 20 (1) ◽  
pp. 47 ◽  
Author(s):  
Narihiro Morosawa ◽  
Yoshihiro Ohshima ◽  
Mitsuo Morooka ◽  
Toshiaki Arai ◽  
Tatsuya Sasaoka
Keyword(s):  

2012 ◽  
Vol 187 ◽  
pp. 23-26 ◽  
Author(s):  
Sonja Sioncke ◽  
Claudia Fleischmann ◽  
Dennis Lin ◽  
Evi Vrancken ◽  
Matty Caymax ◽  
...  

The last decennia, a lot of effort has been made to introduce new channel materials in a Si process flow. High mobility materials such as Ge need a good gate stack passivation in order to ensure optimal MOSFET operation. Several routes for passivating the Ge gate stack have been explored in the last years. We present here the S-passivation of the Ge gate stack: (NH4)2S is used to create a S-terminated Ge surface. In this paper the S-treatment is discussed. The S-terminated Ge surface is not chemically passive but can still react with air. After gate oxide deposition, the Ge-S bonds are preserved and an adequate passivation is found for pMOS operation.


2011 ◽  
Vol 42 (1) ◽  
pp. 479-482 ◽  
Author(s):  
Narihiro Morosawa ◽  
Yoshihiro Ohshima ◽  
Mitsuo Morooka ◽  
Toshiaki Arai ◽  
Tatsuya Sasaoka
Keyword(s):  

2009 ◽  
Vol 255 (17) ◽  
pp. 7831-7833 ◽  
Author(s):  
Santosh M. Bobade ◽  
Ji-Hoon Shin ◽  
Young-Je Cho ◽  
Jung-Sun You ◽  
Duck-Kyun Choi

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