Ultrasonic Characterization of Tensile Overload Effects and Stress Intensity Shielding

Author(s):  
D. K. Rehbein ◽  
O. Buck ◽  
R. B. Thompson
Circulation ◽  
1995 ◽  
Vol 91 (4) ◽  
pp. 1272-1274 ◽  
Author(s):  
Dianna M. Milewicz

2010 ◽  
Vol 108 (1) ◽  
pp. 014909 ◽  
Author(s):  
Z. E. A Fellah ◽  
N. Sebaa ◽  
M. Fellah ◽  
F. G. Mitri ◽  
E. Ogam ◽  
...  

Radiology ◽  
1981 ◽  
Vol 141 (3) ◽  
pp. 811-817 ◽  
Author(s):  
F G Sommer ◽  
L F Joynt ◽  
B A Carroll ◽  
A Macovski

2018 ◽  
Vol 774 ◽  
pp. 66-71 ◽  
Author(s):  
Martin Lederer ◽  
Agnieszka Betzwar Kotas ◽  
Golta Khatibi ◽  
Herbert Danninger

The adhesive strength of ceramic - copper interfaces was measured in four point bending using a central notch for crack initiation. According to our method, plastic deformation may occur during the delamination process. FEM simulations were employed in order to separate elastic and plastic contributions to the energy consumption of the experiment. In conclusion, a novel delamination criterion based on the stress intensity at the crack tip was established. Here, the stress invariant J3is used as indicator for delamination of the interface. Agreement between experiments and theoretical interpretation is demonstrated for copper layers directly bonded to aluminum oxide.


1999 ◽  
Vol 74 (21) ◽  
pp. 3224-3226 ◽  
Author(s):  
Christophe Ayrault ◽  
Alexei Moussatov ◽  
Bernard Castagnède ◽  
Denis Lafarge

1985 ◽  
Vol 68 (6) ◽  
pp. C-146-C-146 ◽  
Author(s):  
Cheng-Kuei Jen ◽  
Paolo Cielo ◽  
Xavier Maldague ◽  
Kamal El-Assal

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